Micron was the first in the industry to offer standard low-power compression attached memory modules (LPCAMM2) to transform mobile and PC user experiences. This innovation marked the first disruptive new form factor for client PCs since the introduction of small outline dual inline memory modules (SODIMMs) in 1997.
Overall, LPCAMM2 delivers higher performance, energy-efficiency, space savings and modularity in the age of AI PCs.
Micron’s LPDDR5X DRAM is incorporated into the LPCAMM2 form factor to provide up to 61% lower power and up to 71% better performance for PCMark^® 10 essential workloads, along with a 64% space savings over SODIMM offerings.
LPCAMM2 delivers the required performance to process AI workloads on PCs and provide the potential to scale to applications needing a high performance and low power solution in a compact and modular form factor, with the ability to upgrade low power DRAM for the first time, as customer needs evolve.
Micron’s leadership in JEDEC and collaboration with key client PC OEMs (such as Lenovo and Intel) and ecosystem enablers helped design and develop the LPCAMM2 form factor. Beyond product development, delivering this new type of memory has involved numerous innovations for test hardware, testing methodologies and automation technologies that will enable an efficient production ramp.

Additional benefits of Micron’s LPCAMM2 include:
• Available in capacities from 16GB to 64GB.
• Higher performance with LPDDR5X to achieve speeds up to 9600Mbps versus 5600Mbps with current DDR5 SODIMMs.
• Up to 80% system standby power savings to improve battery life.
• Up to 7% better performance for digital content creation workloads.
• Up to 15% improvement for productivity workloads in PCMark^® 10 tests.
• Modularity to enable critical serviceability functionality for enterprise IT users and administrators.
• Single PCB for all module capacities to provide supply chain flexibility to OEM and ODM customers.
• Simplified motherboard routing complexity compared to SODIMM.