2024 World Electronics Achievement Awards / Telink Semiconductor(Shanghai) Co., Ltd. / Telink TL721x(TLSR925x) Series SoC
Telink Semiconductor(Shanghai) Co., Ltd.
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Telink TL721x(TLSR925x) Series SoC
Candidate for:2024 World Electronics Achievement Awards - RF/Wireless/Microwave
TL721x(TLSR925x)series SoC is the latest generation of Telink's high-performance, low-power, multi-protocol, and highly integrated wireless connectivity chip family, which is capable of meeting the more stringent demands of future high-performance IoT end-products in terms of low carbon, convergence, security, and intelligence. This chip is the first multi-protocol IoT wireless SoC in China to realize an operating current as low as 1mA (actual test result), a milestone breakthrough among similar products in the market. Adhering to Telink's deep technical accumulation in multi-protocol convergence technology, the TL721x(TLSR925x) supports both Bluetooth@ LE and IEEE 802.15.4-based wireless communication technologies on a single chip and the latest versions of various upper-layer protocol standards. In addition, the chip supports advanced security features to help end products comply with the increasing security access requirements of global target markets.
This chip is suitable for all kinds of high-performance IoT terminal applications, including smart home, smart medical, smart remote control, wearable devices, industrial sensing, location services, and so on.
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