High Performance passive/Discrete Devices-2024 World Electronics Achievement Awards-EE Times

Infineon Technologies

Product：CoolSiC™ SiC MOSFET Discretes & Module (EasyPACK™ 3B & 62mm)

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Infineon Technologies

Product：XHP™ 2 CoolSiC™ MOSFET 3.3kV with .XT

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Molex

Product：MX-DaSH Data-Signal Hybrid Connector

Recommended reasons： The Molex MX-DaSH Data-Signal Hybrid Connector Portfolio is an innovative family of wire-to-wire and wire-to-board connectors that consolidate power, signal and high-speed data connectivity in a single connector system. They are specifically designed to meet the growing demand for smaller, more cost-effective in-cable and zonal architecture applications in the automotive industry. All connectors in the new range are compact, yet robust with all the functionality necessary to empower automotive design engineers to accommodate a growing mix of devices and sensors with different network requirements. By offering modular sections or cartridges in the wire to board option that support various interfaces without changing form factors or footprints, MX-DaSH minimises the cost and complexity of traditional wiring harnesses, which is a massive benefit when you consider that vehicle package space is a highly precious commodity in almost every design. High-speed data connections are often made using a singular connector alongside traditional power and signal connections. Such high-speed connections must typically be individually routed in the vehicle, which increases the bill of material (BOM) and process costs for the manufacturer. However, by combining these two circuit types into one connector, the MX-DaSH connector gives the electrical designer far more flexibility while lowering overall wiring costs. With wire-to-board connectors designed for automated assembly operations, the MX-DaSH system also contributes to lower assembly costs and improved process efficiency. Because the MX-DaSH connectors in the new range are so tightly unified, they significantly reduce the overall weight and BOM required to manufacture. Moreover, their ability to support automated assembly processes simplifies manufacturing process and decreases labour requirements. The MX-Dash Connector System is ideal for a wide range of automotive applications, from autonomous driving modules and camera systems to GPS and infotainment devices. The versatility this system offers, through a range of different terminal sizes and types, now gives designers what they’ve long awaited — the freedom to easily mix-and-match connectors for use across diverse vehicle designs and applications. One of the many benefits of the MX-DaSH Connector System is that in addition to combining traditional power and signal circuits with high-speed data, it incorporates industry-leading features such as male blade stabilization to protect male blades from damage during terminal mating. There are also independent secondary lock features for improved terminal retention on both the male and female connector housings, the benefits these features offer cannot be found anywhere else. The MX-Dash Connector System addresses the industry’s need for a smaller and low-cost connectivity package with high-speed data transfer capabilities in a more compact form.

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TE Connectivity

Product：TE FP20 auto Antenna Family

Recommended reasons： FP20 auto antennas provide a combination of 4G, 5G, CBRS, Wi-Fi, Bluetooth and GNSS to address your connectivity requirements. The product family includes multi-port aerodynamic solutions up to 9 ports, along with a range of additional whip antenna and connector options to suit all major vehicular gateways and routers. FP20 auto antennas are supplied as a complete kit including the base antenna and appropriate extension cable in order to meet the port requirements of major vehicular gateways and routers. The antennas are supplied as a kit with 5 meter (16 ft.) extension cables as standard as well as a range of connector options. A choice of optional interchangeable whip antennas also allows for additional communications in VHF, UHF, or combined ‘VHF, UHF & 700/800/900 MHz’. The antenna series was designed with a global capability in mind and therefore support the B11, B32, B21 in 1450 MHz range, for Europe and Japan. L1 and L5 GNSS is also included, in the FP20 auto series, for improved positioning accuracy and response times. In addition for configurations using both a gateway/router and 2-way mobile that each require a GNSS antenna. Product Features: • Configurations available up to 9-port incorporating next-generation technology • Coverage of all LTE/5G bands (617-7125 MHz), Wi-Fi 6E/7, Bluetooth and GNSS • Designed for applications demanding the highest data rates and lowest latency • Future-proofed against future 4G/5G frequency rollouts up to 7125 MHz and Wi-Fi 6E/7 rollouts • Compatible with all major router and gateway products • Optional high power whip antennas, handling up 60 Watts • Customizable connector, cable length and port configurations • R118 compliant cables qualified for “burn behaviour” supplied as standard • Supports B11, B32, B21 in 1450 MHz range, for Europe and Japan • L1 and L5 GNSS for improved positioning accuracy and response times • Out of band rejection filters maintain consistent performance • High data throughput is enabled by technologies such as carrier aggregation • Superior gain patterns, low gain ripple, high gain at horizon and efficiency of over 70% • UV, Flammability, Humidity, Impact, Vibration, Shock certified

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TE Connectivity

Product：TE Stacked QSFP-DD 112G Connectors and Cages

Recommended reasons： TE Connectivity (TE) stacked quad small form factor pluggable double density (QSFP-DD) 112G connectors and cages are the next generation of data infrastructure interconnect solutions to support high density data centers, cloud computing, and artificial intelligence operations. Stacked QSFP-DD 112G solutions enable operations at 112G PAM4 speeds and are built to mechanical and performance standards developed by companies under a QSFP-DD multi-source agreement (MSA). TE offers a complete vertically integrated manufacturing solution, with expertise in both connector and thermal development. TE’s next generation QSFP-DD products are aligned with the industry’s 112G channel performance needs on signal integrity performance. • Compliant to QSFP-DD MSA specification and IEEE 802.3ck specification signal integrity performance. • Increased data rates – supporting aggregate data rates of 800 Gbps per port. • Cages support customized and integrated heat sink designs for increased thermal performance. QSFP-DD cages are fully backwards compatible, providing an upgrade path from existing QSFP solutions - allowing an economical path to upgrade to 112G operations. • Backwards compatible from existing QSFP solutions – allowing for a seamless upgrade to 112G operations. Due to demands on next generation designs to support hyperscale data centers and machine learning infrastructures, TE has developed one of the most comprehensive and flexible 112G portfolios on the market. • Both design customization and manufacturer supported, allowing for vertical supply chain integration which helps to reduce risk through single source procurement.

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Vishay

Product：ISOA

Recommended reasons： The ISOA is an AEC-Q200 qualified thick film power resistor in the compact, low profile SOT-227 package for mounting on a heatsink. It is the only such device available with an optional NTC thermistor for internal temperature monitoring and pre-applied Phase Change Thermal Interface Material (PC-TIM) for more efficient mounting — all without a metal tab. Instead, it’s built on an exposed alumina substrate, which lowers costs for automotive applications, in which the device serves as a precharge, discharge, active discharge, or snubber resistor. With the option to integrate an AEC-Q200 qualified, temperature cycle tested NTC thermistor inside the resistor package, the ISOA simplifies designs and saves board space, while its optional PC-TIM streamlines installation in production. The resistor’s high pulse handling capability and high power dissipation up to 120 W at an 85 °C bottom case temperature provide additional space and cost saving by reducing the need for power components. For applications subject to high and repetitive pulse surges, the device can handle high energy pulses (i.e., 110 J for 0.1 s) and is multi-pulsed tested at 230 J for 670 ms and 3000 cycles and 350 J for 1060 ms and 5000 cycles. Additional custom testing options for the resistor are also available. ISOA offers lower resistance than competing solutions — down to 0.47Ω — with tolerances of ± 5 % and ± 10 %, and TCR of ± 100 ppm/K, ± 150 ppm/K, and ± 300 ppm/K. The resistor offers a maximum operating voltage of 1500 V, an operating temperature range of -55 °C to +150 °C, and dielectric strength of 4000 Vrms. With its lower thermal resistance of 0.25 K/W, the ISOA can dissipate more power at +150 °C than other thick film resistors can at +155 °C. The RoHS-compliant device offers a non-inductive design and can include two different resistors.

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TDK

Product：Smart Multilayer Aluminum Nitride (AlN) Substrate

Recommended reasons： Wide bandgap (WBG) power semiconductors made from silicon carbide (SiC) and gallium nitride (GaN) are more and more deployed in applications like wind turbines, photovoltaic (PV) inverters, traction inverters for electric vehicles (EV), and EV fast chargers. Although these new semiconductors elevate the power density of these applications, they struggle with sufficient heat dissipation as power loss density also increases while chip sizes decrease. TDK’s new smart aluminum nitride (AlN) multilayer substrate pushes the boundaries of these wide bandgap semiconductors in terms of power density, reliability, and compact size. It is the key to more efficient EVs, lighter and more compact PV inverters, or significantly higher output power in an existing footprint. TDK develops and customizes specific AlN packages and substrates for all high-power applications. It is a solution provider for smart multilayer substrates, bringing design to mass production. Everything from a single source, manufactured in Europe. Tested, verified, and approved to the highest industry standards.

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