Memory-2024 World Electronics Achievement Awards-EE Times

Xinsheng Intelligent Technology Co., Ltd.

Product：Walker SE，XT6160

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Product：KIOXIA Automotive UFS 4.0 Series

Recommended reasons： Although the UFS 4.0 products on smartphones have been widely used, the products in the field of automotive UFS 4.0 are still relatively blank. KIOXIA automotive UFS 4.0 is the industry's first automotive UFS 4.0 product, which provides a solid foundation for the popularity of automotive UFS 4.0. KIOXIA automotive UFS 4.0 is a high-performance vehicle storage product designed for intelligent driving scene, which adopts independent research and development master control, so as to realize the fine management of flash memory by the controller, and then improve the storage performance. Compared with eMMC, UFS has more advantages in transmission rate. It uses serial interface and supports full-duplex communication, it can read and write data at the same time. KIOXIA also actively participated in the formulation of M-PHY and UniPro specifications of UFS 4.0. it can better combine the equipment to achieve data transmission in an efficient and reliable way, and then improve the storage performance and the overall response speed of the system, thus promoting the technological development process of the whole industry. KIOXIA UFS 4.0 can achieve maximum read and write 4000MB/s and 2000MB/s, which is twice speed than UFS 3.1. About the temperature, KIOXIA automotive UFS 4.0 provides a working temperature range of -40 ℃ to 105 ℃, which meets the requirements of AEC-Q100 Grade 2. UFS 4.0 also supports the HS-LSS (High Speed Link Startup Sequence) function, which can help the on-board system start at high speed and has the diagnostic function of equipment operation history. KIOXIA UFS 4.0 is not only efficient and reliable, but also works with the industry to break through the technical bottleneck, provides reliable industry experience and evaluation scheme for the industry, and also provides an excellent foundation for the follow-up high-level self-driving. In terms of capacity, KIOXIA provides three capacity products: 128GB, 256GB and 512GB to choose from, providing a strong guarantee for in-vehicle storage, autopilot and smart cockpit upgrades.

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KIOXIA (China) Co.,Ltd.

Product：KIOXIA CD8P Series Data Center SSD

Recommended reasons： KIOXIA CD8P series is the industry's first PCIe 5.0 NVMe SSD product built for data centers. It has a sequential read performance of 12GB/s. It takes into account cost, performance and advanced BiCS FLASH™ technology, and is more in line with data center cost, performance and cooling considerations, and is suitable for multiple application scenarios such as artificial intelligence, large models, cloud applications, big data, IoT, large-scale supercomputing, online transactions and virtualization. KIOXIA CD8P series is built with 112-layer BiCS FLASH 3D TLC NAND and in-house controller. It provides U.2 2.5-inch specification with a maximum capacity of 30.72TB. And also have forward-looking EDSFF E3.S. KIOXIA CD8P 2.5-inch series meets the mainstream demand of the Chinese market, with a maximum capacity of 30.72TB, which can help data center and server storage applications obtain larger capacity storage without changing the internal structure of existing servers upgrade. At the same time, KIOXIA CD8P E3.S series can further optimize the internal structure of the server, improve storage density per unit space, improve power efficiency and rack integration. The maximum capacity can reach 15.36TB, suitable for AI artificial intelligence computing acceleration, big data, cloud computing and other application scenarios.

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Netac Technology Co.,Ltd.

Product：NV7000-t

Recommended reasons： With PCIe Gen4 x4 interface and advanced NVMe 1.4 protocol, NV7000-t matches the sequential read speeds of up to 7400MB/s. With advanced temperature control and a sleek heatsink design, it allows for even, real-time heat dissipation to maintain powerful performance. Support M.2 2280 slim form factor, compatible with desktop, all-in-one, and notebook devices, and easy to upgrade and speed up. Built with the latest 3D NAND flash technology to bring it greater reliability and performance. Supports HMB and SLC cache technology, which intelligently optimizes cache space to reduce lagging. NV7000-t NVMe SSD available in a range of capacities up to 4TB to meet your data storage requirements. NV7000-t supports PS5 consoles expansion requirements, so it can easy to storage more games and reduce gaming load times. The user can easily access Netas's own SSD Tool Box Software features such as data migration, firmware upgrade, secure erase, hard drive optimization, and more.

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Silicon Motion Technology (Shenzhen) Co., Ltd.

Product：Ferri-UFS^®

Recommended reasons： Ferri-UFS is a highly integrated solution that combines the UFS2.1/3.1 standard with standard NAND flash controller functions. With its high-performance storage, excellent energy efficiency, and user-friendly system design, Ferri-UFS is an ideal solution for automation, industrial, embedded, and portable applications. For in-vehicle infotainment system applications, Ferri-UFS offers low dppm, AEC-Q100 Grade 3/2 certification, and support for product longevity. The Ferri-UFS product line supports the latest UFS 3.1 standard with the SM671 storage product, featuring a UFS3.1 HS-Gear4x2 channel interface design, providing an efficient, high-capacity, and low-power consumption solution for embedded storage, meeting the most stringent quality and reliability requirements for automotive and industrial control applications. Compared to UFS 2.1, UFS 3.1 introduces the following new features: Write Booster Technology: By introducing an SLC Cache on devices compliant with the UFS 3.1 standard, write speeds are further enhanced. Deep Sleep Technology: When there are no read/write actions, the memory enters a deep sleep mode, achieving the lowest power consumption, reducing idle power consumption by 30~50% compared to UFS3.0. Performance Throttling Notification: UFS 3.1 devices promptly notify the host of any performance limitations when storage performance is affected by certain conditions. Advanced driver-assist and infotainment features in new vehicles increasingly require high-reliability, high-speed storage solutions. Ferri-UFS applications for automotive use, compliant with the UFS 3.1 standard, offer superior performance, reliability, and power efficiency among embedded storage devices. Ferri-UFS products undergo rigorous testing to meet the needs of the automotive industry and customers, including compliance with AEC-Q100 standards and IATF 16949 supply chain certification. Additionally, Silicon Motion ensures long-term product availability, reducing additional certification costs for customers.

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Shenzhen Techwinsemi Technology Co., Ltd

Product：TW6501 SATA SSD

Recommended reasons： TWSC's new SATA controller TW6501. This controller performance and flash support energy can compete SMI and MAXIO SATA controller. Currently TW6501 is only support ONFI 5.0 mode flash like as YMTC new process flash in SATA controller,4K LDPC error correction can make sure product reliability and lifetime. TW6501 sequential read/wite performance a little better than SMI and MAXIO，but random read/write large better than SMI and MAXIO. TW6501 IC deisgn margin can make sure smoonthly working in -40~100 degree, so this conttoller can easily support industrial market. TWSC's experienced R&D team, with deep knowledge of IC design, flash memory, and temperature effects, ensures controllers meet automotive standards through rigorous screening methods, tailored for the industry's high demands.

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Dosilicon Co., Ltd.

Product：2xnm 4Gb SPI NAND Flash

Recommended reasons： Dosilicon's SPI NAND Flash is a serial peripheral interface SLC NAND Flash which the memory array and controller are integrated on one cell, with an internal ECC module. It not only offers satisfactory data transmission efficiency, but also saves space and enhances stability. It now incorporates 2x nm process technology. SPI NAND Flash is suitable for two voltages, and comprises several packages, which are applicable to varied application scenarios. Specification： Density：4Gb Voltage: 1.8V/3.3V Temperature: -40℃~85℃ Speed: 83MHz/104MHz Package: WSON 8x6

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GigaDevice Semiconductor Inc.

Product：GD25/55NF Series SPI NOR Flash with 1.8V power supply and 1.2V I/O Voltage

Recommended reasons： GD25/55NF is a new series of Quad SPI NOR Flash products with dual-voltage supply introduced by GigaDevice. Its core supply voltage is 1.8V, with an IO interface voltage of 1.2V. It boasts a maximum clock frequency of 166MHz for STR and 104MHz for DTR, with a peak data throughput of up to 104MB/s. Designed to meet the demand for SoCs operating at 1.2V, the GD25/55NF product line facilitates data communication with 1.2V SoCs without requiring voltage boosting circuits, thereby simplifying system circuit design. Additionally, lowering the IO interface voltage can save up to 40% of read power consumption compared to the conventional 1.8V SPI NOR Flash solutions. Compared to conventional 1.2V SPI NOR Flash solutions, the GD25/55NF series offers higher read performance and faster erase times, making it especially suitable for applications requiring rapid response, such as artificial intelligence, IoT, wearable devices, and automotive electronics. In summary, the GD25/55NF series presents an excellent solution for SoCs with low-power and high-performance requirements for SPI NOR Flash.  1.8V Power Supply, 1.2V I/O Voltage  Density from 128Mb to 2Gb  Quad DTR SPI interface, compatible with Single, Dual, and Quad SPI instruction sets  Data throughput up to 104MB/s  Supports XIP (Execute-In-Place)  Supports DQS and DLP functions, aiding in high-speed system optimization design  Supports ECC and CRC, enhancing product reliability and high-speed I/O signal accuracy  Supports package solutions such as KGD, SOP16 300mil, and 24ball TFBGA

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Micron Technology

Product：Micron Technology LPCAMM2

Recommended reasons： Micron was the first in the industry to offer standard low-power compression attached memory modules (LPCAMM2) to transform mobile and PC user experiences. This innovation marked the first disruptive new form factor for client PCs since the introduction of small outline dual inline memory modules (SODIMMs) in 1997. Overall, LPCAMM2 delivers higher performance, energy-efficiency, space savings and modularity in the age of AI PCs. Micron’s LPDDR5X DRAM is incorporated into the LPCAMM2 form factor to provide up to 61% lower power and up to 71% better performance for PCMark^® 10 essential workloads, along with a 64% space savings over SODIMM offerings. LPCAMM2 delivers the required performance to process AI workloads on PCs and provide the potential to scale to applications needing a high performance and low power solution in a compact and modular form factor, with the ability to upgrade low power DRAM for the first time, as customer needs evolve. Micron’s leadership in JEDEC and collaboration with key client PC OEMs (such as Lenovo and Intel) and ecosystem enablers helped design and develop the LPCAMM2 form factor. Beyond product development, delivering this new type of memory has involved numerous innovations for test hardware, testing methodologies and automation technologies that will enable an efficient production ramp. Additional benefits of Micron’s LPCAMM2 include: • Available in capacities from 16GB to 64GB. • Higher performance with LPDDR5X to achieve speeds up to 9600Mbps versus 5600Mbps with current DDR5 SODIMMs. • Up to 80% system standby power savings to improve battery life. • Up to 7% better performance for digital content creation workloads. • Up to 15% improvement for productivity workloads in PCMark^® 10 tests. • Modularity to enable critical serviceability functionality for enterprise IT users and administrators. • Single PCB for all module capacities to provide supply chain flexibility to OEM and ODM customers. • Simplified motherboard routing complexity compared to SODIMM.

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Puya Semiconductor（Shanghai）Co., Ltd.

Product：P25Q32SN

Recommended reasons： P25Q32SN: The industry's first high-performance Flash memory chip with a 1.1V 6.5UJ/Mbit next-generation leading process, ultra-low voltage and ultra-low power consumption, designed for AIOT. This series of products can be used for devices powered by batteries with limited design space, such as mobile devices, IoT, and wearable devices. It can be specifically applied to the functional areas of device startup, Bluetooth, WIFI connection, etc. ·Supports a 1.1V power system, which is the lowest in the industry and has a wide voltage range of 1.05V~2.00V, covering 1.1V, 1.2V, and 1.8V AIOT systems; ·Adopting the industry's innovative process and leading 40nm SONOS process; ·At present, the lowest power consumption in the industry is about 2.86mW for reading 1.1V 80M STR 4IO, and about 4.2mW for reading 80M DTR 4IO; ·Quick read: 416Mbps (STR 4IO); 640Mbps (DTR 4IO)； ·Simultaneously supporting various packaging forms such as SOP8, USON8, WSON8, TSSOP8, WLCSP, as well as KGD for SiP; ·Based on extremely low power consumption, it provides necessary storage assistance for multimodal SoC intelligent control chips such as audio and image, helping to improve the domestic ecological chain of the metaverse.

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Shenzhen Longsys Electronics Co., Ltd.

Product：FORESEE LPCAMM2

Recommended reasons： Established in 1999, Longsys (stock code:301308.SZ) is a branded semiconductor memory enterprise. Longsys is mainly engaged in the research, development, design, packaging & test, manufacture and sales of semiconductor memory products. The company has four product lines: embedded storage, solid-state drive (SSD), mobile memory, and memory module. Longsys has formed core competitiveness in memory chip design, memory controller design, firmware algorithm development, packaging & testing and manufacturing. It provides a range of storage products including consumer-grade, industrial-grade, automotive-grade and enterprise-grade storage solutions, along with software and hardware application solutions for industry storage. Longsys owns the industry storage brand FORESEE and international high-end consumer storage brand Lexar. Longsys memory products are widely used in mainstream consumer intelligent terminals such as smartphones, wearable devices, personal computers and so on. In addition, they are also used in data centers, automotive electronics, Internet of Things (IoT), security monitoring, industrial control and personal consumer retail market.

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