Microcontroller/Interface-2024 World Electronics Achievement Awards-EE Times

Product：EFM32PG26(PG26) 32bit MCU

Recommended reasons： The EFM32PG26 (PG26) 32-bit microcontroller (MCU) family is a software-compatible, MCU-only version of the EFR32xG26 wireless SoC platform, namely PG26. PG26 32-bit MCUs provide up to 2 MB Flash and 256 kB RAM, which are ideal for enabling a wide range of low-power and high-performance embedded IoT applications. The highly efficient PG26 offers a 80 MHz ARM Cortex-M33 with LCD controller, rich analog and communication peripherals, low current consumptions, and more GPIOs to address complex systems. The PG26 is also equipped with a hardware AI/ML accelerator allowing for faster inferencing at the edge with lower power consumption.

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Shenzhen CVA Innovation Co., LTD

Product：TMCU

Recommended reasons： The TMCU series is the first domestically produced automotive-grade MCU capable of supporting capacitive touch loads exceeding 4nF. With the CVA proprietary patented capacitance detection technology, TMCU offers extremely high capacitance detection accuracy. Manufactured with a 40nm domestic process, it achieves an ASIL-B level of functional safety. Features: CPU operating frequency up to 80MHz Maximum 224KB of program flash (PFlash) 32KB of data flash (DFlash) Up to 16KB of data storage (SRAM) 30 channels of self-capacitance, 15x15 channels of mutual capacitance Capable of detecting load capacitance up to 4nF Application Fields: Widely applicable to all automotive controllers requiring touch functionality, including but not limited to steering wheel hand-off detection controllers, air conditioning touch panels, auxiliary dashboard touch panels, interior reading lights, door touch handles, and foot-kick tailgate applications. Advanced: This project innovatively integrates Touch IC and MCU into a single chip, providing car manufacturers with a single-chip solution for touch applications. This not only facilitates developing car manufacturer solutions but also simplifies material management and ensures the security of the domestic automotive-grade chip supply chain. Mass Production Capability: Automotive chips have extremely high requirements for product safety and reliability, and the corresponding product development and verification often take 2 to 3 years. This project was initiated in July 2022, and has already achieved chip tape-out verification and small-scale sampling tests. It is expected to achieve mass production and shipment of chips by the end of 2024. Comparison with Competitors: The TMCU series innovatively integrates Touch IC and MCU into a single chip, providing car manufacturers with a single-chip solution for touch applications, which simplifies material management and offers superior performance and cost-effectiveness. It supports load capacitance detection up to 4nF, setting a new industry standard. Compared to similar brand chips, it delivers better performance at a lower cost.

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Metanergy Inc.

Product：MYi0002V0405

Recommended reasons： We has launched a rare domestically integrated star product, "Gathered at One Core, Extraordinary" — MYi0002V0405. This product integrates MCU, Driver, and MOSFET into one, with an integrated design that can reduce the overall board area by at least 50%. It perfectly addresses pain points such as volume, surface mounting, and heat dissipation, widely applicable in fans, small water pumps, and automotive thermal management systems. Besides providing customers with better reliability, it also offers cost reduction advantages. The product has an internal resistance of about 55 milliohms. Under equivalent current conditions, the heat generated by similar products from competitors is at least 3-5 times that of our products. It effectively reduces the difficulties of terminal devices in heat dissipation and circuit board area, solving problems such as product failures and shortened lifespan due to overheating. It meets the demand for miniaturization of terminal equipment. Solutions developed based on this product can optimize complex circuit boards from double-sided or four-layer boards to single-sided boards, enabling customers to quickly produce stable, high-yield products.

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Texas Instruments

Product：MSPM0 Arm^®-Cortex^® M0+ MCU portfolio

Recommended reasons： The MSPM0 MCU portfolio delivers a wide range of computing options from 24 MHz to 80 MHz with math acceleration and multiple configurations of integrated analog signal-chain components, including the industry’s first zero-drift operational amplifier on an MCU and precision 12-bit, 4-MSPS analog-to-digital converters. This flexibility helps designers meet their current design’s requirements and plan for future designs – all within the same MCU portfolio. This portfolio includes the MSPM0G3507, an M0+ MCU that can operate up to 80 MHz and in an extended temperature range from -40°C to 125°C. Designers can also optimize board space in their designs with MSPM0 MCUs that are more than 7 times smaller than competing 8-pin packages, like the MSPM0C1104 which is available in a 2mm-by-2mm package. Additionally, designers of automotive applications, like for body control modules, can benefit from the size and cost optimization and high level of integration of MSPM0 MCUs with AEC-Q100-certified options like the MSPM0L1305-Q1.

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Geehy Microelectronics Inc.

Product：G32R5 Series Real-Time Microcontroller

Recommended reasons： 1. Main features and specifications: G32R5 Series Real-Time Microcontroller,the world's first dual-core real-time MCU based on the Arm^® Cortex^®-M52 processor with MCU/DSP architecture adopts advanced 40nm eFlash technology, with a working frequency of 250-300MHz. It supports Arm Helium™ vector expansion technology and can achieve advanced DSP/ML functions to accelerate computationally intensive applications; Built in Zidian™ mathematical acceleration unit developed by Geehy, combined with Cortex-M52 CDE interface, greatly improves algorithm execution efficiency. 2. Compare the advantages of competitors The G32R5 series real-time MCU has excellent computational processing capabilities, with real-time computing power comparable to 800MHz Cortex-M7 core products, which helps reduce algorithm overhead and improve control loop bandwidth; High performance real-time control peripherals, such as high-speed sampling ADC units and HRPWM units with a resolution of 151ps, effectively improve accuracy and reduce latency in system sampling and control; Flexible control of peripheral interconnection, supporting digital power topologies such as Vinena PFC, LLC, DAB, PSFB, etc., and providing a simple path with low delay and high consistency for signal links, such as controlling PWM duty cycle through on-chip comparator to achieve peak current mode control (PCMC) for higher power density; Simultaneously optimized in terms of software and hardware compatibility, achieving rapid development with less investment to assist customers in completing product mass production; We have achieved industry-leading performance in ESD/EMC by optimizing reliability implementation. 3. Application areas: Suitable for renewable resources, industrial automation, commercial power supply, new energy vehicles and other fields, specifically for segmented applications such as servo controllers, humanoid robots, frequency converters, micro inverters, OBCs, vehicle compressors, communication power supplies, etc.

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GigaDevice Semiconductor Inc.

Product：GD32VW553 series Combo Wireless MCU based on the RISC-V core

Recommended reasons： The GD32VW553 series MCU incorporates a new open-source instruction set architecture with the RISC-V processor core, boasting a maximum clock frequency of 160 MHz. Additionally, it incorporates advanced DSP hardware acceleration, a double-precision floating-point unit (FPU), instruction expansion interfaces, and various other resources. Through excellent microarchitecture design, this combination results in outstanding energy efficiency, while providing flexibility for scalability. The integrated 2.4 GHz Wi-Fi 6 RF module follows the IEEE 802.11ax standard and is backward compatible with the IEEE 802.11b/g/n standard, ensuring its suitability for different network environments. The integrated Bluetooth LE 5.2 RF module extends the communication distance, increases throughput, enhances security, and saves power following the latest Bluetooth specifications. The Combo Wireless MCU offers advanced baseband and RF performance with a variety of additional features. It supports the wireless coexistence protocol based on the Package Traffic Arbitration (PTA) mechanism, significantly reducing same-frequency interference caused by Wi-Fi and Bluetooth; thereby enhancing the stability of signal reception. The GD32VW553 series integrates up to 4MB Flash, 320KB SRAM, and 32KB configurable Instruction Cache (I-Cache) to greatly improve CPU processing efficiency. The GD32VW553, delivering excellent wireless performance, is also equipped with rich universal wired interfaces, including three U(S)ART, two I2C, one SPI, one four-wire QSPI, and up to 29 programmable GPIO pins. Its built-in components include two 32-bit general-purpose timers, two 16-bit general-purpose timers, four 16-bit basic timers, one PWM advanced timer, and one 12-bit ADC. The GD32VW553 series also provides multiple security features to streamline secure connection and management of high-performance wireless devices. It supports the Wi-Fi Protected Access (WPA) security feature, incorporating new WPA3 encryption technologies for both personal and corporate networks. The hardware encryption and decryption engine support DES, triple DES, AES, and Hash algorithms. It also supports Public Key Cryptographic Acceleration Unit (PKCAU) to ensure confidentiality and data integrity during wireless communication. The True Random Number Generator (TRNG) can provide unpredictable data for key generation across a variety of security protocols, further enhancing the system's security capabilities.

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Goke Microelectronics Co.,Ltd.

Product：High Speed Serializer GK1360V100 and Deserializer GK1361V100

Recommended reasons： The GK1360V100 chip is a Serializer chip designed for the field of in vehicle electronic information transmission, used in conjunction with the GK1361V100 chip (deserializer). Mainly used in car driving assistance systems, surround view systems, driver monitoring systems, front and rear intelligent camera monitoring systems. The forward channel transmission rate of GK1360V100 and GK1361V100 can reach 6.4Gbps, and the reverse channel transmission rate can reach 200Mbps. This series of chips supports system interfaces that comply with MIPI D-PHY v1.2 and MIPI CSI-2 v1.3 standards, and can meet the visual sensor data transmission of 800M pixels. It supports bidirectional audio, bidirectional SPI, optional data encoding modes, and supports simultaneous transmission of audio signals, video signals, and control signals (I2C, SPI, I2S, GPIO). This series of chips can transmit signals through cost-effective coaxial cables or shielded twisted pair cables, with a transmission distance of up to 15 meters, and supports reverse power supply through wires. GK1360V100 and GK1361V100 comply with ISO26262 ASIL B requirements, AEC-Q100 standards, and meet the working temperature range of Grade 2 -40 ℃~105 ℃. They have advanced technology and low power consumption.

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Infineon Technologies

Product：Infineon 32-bit MCU AURIX TC4x

Recommended reasons： The TC4x family is the third generation of Infineon's AURIX™ family of microcontrollers, with a high performance fully lock-step six-core architecture, excellent real-time performance, and the integration of different accelerators on chip, such as parallel processing units (PPU), converter DSPs (CDSP), and hardware data routing engines (CRE/DRE). All models can reach the highest level of functional safety ASIL-D, compliant with ISO21434 cyber security standards, integrated with a variety of hardware encryption accelerator and high-performance encryption real time module, to meet the needs of the post-quantum era of encryption. On-chip high-speed communication interfaces, including 5G Ethernet, PCIe, CAN XL, CAN FD, etc., meet diversified network communication needs. The hardware supports virtualization, and multi-application integration can be realized by deploying virtual machine software. 1． Performance increase: full lockstep cores at 500 MHz, with high speed data routing engine 2． Parallel processing unit (PPU): SIMD vector DSP Co-processor, multiple AI use cases 3. Hypervisor & virtualization: virtualization with hypervisor software enable many applications integration with ensured Freedom From Interference 4.Functional safety: ISO26262-2018 ASIL-D compliant 5. Cyber security: ISO21434 certified, and China SM security algorithms supported 6. AURIX™ software ecosystem: trusted global and local partners provide proved tool chains and software solutions.

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China Micro Semicon Co.,Limited

Product：BAT32A239

Recommended reasons： BAT32A2 series are automotive-grade, high-quality 32-bit MCUs independently developed by Cmsemicon, which are suitable for automotive complex control conditions and harsh environments with high safety and reliability. BAT32A239 is a mid-end automotive grade MCU based on Arm Cortex^®-M0+ core, with an operating frequency of 64MHz, 256KB Flash, 32KB SRAM and 2.5KB dedicated Data Flash, integrated multiple advanced timers, rich analog peripherals, and 2-channel CAN/LIN and other communication interfaces. The operating voltage range is 2.0-5.5V, the operating temperature is -40℃~125℃, and LQFP48, LQFP64, LQFP80 packages are available. With its excellent features, the BAT32A239 series has been commercially available in OEMs and Tier 1 clients, covering a wide range of in-vehicle electronic control modules, such as headlights/taillights, digital instrument clusters, gearshift actuators, digital keys, DC/DC power supplies, seat controllers, lumbar massager controllers, ultrasonic radars, ripple anti-pinch actuators, AQS sensors, and other body domain related applications.

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Shanghai MindMotion Microelectronics Co., Ltd.

Product：MM32F5333

Recommended reasons： MM32F5330 Features 1. 180MHz STAR-MC1 processor with built-in single precision floating point unit FPU and DSP extension support 2. 128KB Flash, 32KB SRAM, integrated rich I/O ports and peripheral modules 3. Four UARTs, one USART, one LPUART 4. One USB 2.0 with integrated internal PHY, one FlexCAN-FD interface 5. Two I2C, one I3C slave, three SPI or I2S 6. Two 3MSPS 12-bit ADCs, one 12-bit DAC 7. Two 16-bit Adv. Timers, six GP Timers, one LP Timer 8. Operating voltage: 1.8V ~ 5.5V 9. Operating temperature range: -40°C ∼ +85°C and -40°C ∼ +105°C 10. Package type: LQFP64/48, QFN32 Application： 1. Industrial control 2. Encoders 3. PC accessories 4. Gaming accessories 5. Appliance control 6. Motor control 7. Floor cleaner 8. Mini LED Main Advantages and Competitive Features: 1. This product adopts the innovative Armv8 architecture processor, boosting core performance by 20% compared to Cortex-M4. It utilizes efficient cache design to overcome the bottleneck of Flash execution efficiency. 2. Configuring CAN-FD accelerates and reduces costs for industrial, firefighting, energy storage, and automotive applications. 3. Supports USB host and expands to 16 endpoints, effectively addressing the pain points of virtual serial ports. 4. Efficient cache architecture effectively resolves Flash execution speed bottlenecks. 5. Storage ECC ensures functional safety. Currently, in industries with high security requirements, all Flash and RAM in this product are equipped with ECC error correction, ensuring the security of the MCU's most critical components. 6. Configured with I3C interface. As a mainstream interface for communication between computer CPUs and onboard peripherals, this product integrates the I3C interface to support computer peripheral controller applications. 7. Up to 4 SPI interfaces. With Mini-LED applications becoming more widespread, technologies like local dimming require multiple SPI interfaces. This product provides the optimal solution for applications such as Mini-LED.

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Nations Technologies Inc.

Product：N32H482/487/473/474 series high performance MCUs

Recommended reasons： 1. Main features and technical specifications The product features excellent performance, higher integration, ultra-high precision timing, and high reliability. The main technical specifications are as follows: ● 32 bit ARM Cortex-M4 core, with a maximum operating frequency of 240MHz, supporting floating-point operations and DSP instructions ● Integrate up to 512KB embedded encrypted Flash, 192KB SRAM (including 32KB CCM SRAM), and 4KB Backup SRAM ● Integrate 4 12bit 4.7Msps ADCs, up to 8 12bit DACs, 4 PGAs, and 7 COMPs ● Integrate USB FS Device, USB HS DualRole, U (S) ART, I2C, SPI, CAN-FD, Ethernet, DVP and other communication interfaces, support I2S audio interface ● Supports SDIO, FEMC, and xSPI high-speed storage interfaces ● Supports ultra high precision timers, multiple advanced timers, universal timers, basic timers, and low-power timers ● Supports Cordic and FMAC, built-in hardware acceleration engine for cryptographic algorithms, supports AES/3DES, SHA, SM3, SM4, MD5 algorithms, supports TRNG true random number generator, supports CRC16/32 ● Working conditions: - Working voltage range: 1.8V~3.6V - Working temperature range: -40 ℃~105℃/125℃ - ESD: ± 4KV (HBM model), ± 1KV (CDM model) - EFT: VDD (+/-4KV, Class A), I/O (+/-2KV, Class A) 2. Main advantages and application areas The N32H482/487/473/474 series high-performance MCUs are new generation of high-performance craftsmanship products by Nations Technologies Inc. It has application advantages in digital power control fields such as communication/server power supply, UPS, portable energy storage power supply, industrial control fields such as frequency converter, servo, PLC, photovoltaic inverters, energy storage BMS, automotive OBC, battery swapping cabinets/charging piles, as well as high-performance motor control fields such as industrial robots and electric friction controllers.

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Renesas Electronics

Product：Renesas R-Car Generation 5 Family

Recommended reasons： Renesas’ fifth-generation R-Car SoC incorporate chiplet technology to create a flexible platform that can be customized to meet various requirements for each use case. The new platform will offer multiple processor sets from entry-level to higher-end models, and can integrate a variety of IP such as AI accelerators and IP by partners and customers into a single package. This will give users the option to customize designs according to their needs. The R-Car Gen 5 family is built around Arm-based compute engines and includes a portfolio of high-performance 64-bit SoCs, crossover 32-bit MCUs and automotive control 32-bit MCUs that enable improved flexibility, adaptability and higher levels of integration. The new family scales vertically and horizontally across all vehicle models, performance grades and applications and was designed with a heavy focus on software re-use spanning multiple vehicle products and generations. Through the introduction of the Renesas R-Car Gen 5 portfolio, we are offering customers complete scalability in a family that extends from low-end control MCUs, to moderately complex zonal-domain MCUs and more complex crossover MCUs, to a high-end range of SoC products.

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STMicroelectronics

Product：STM32H7RS

Recommended reasons： The STM32H7R7/S7 line is a bootflash-based MCU powered by a Cortex^®-M7 core running up to 600 MHz, with 64 Kbytes of user bootflash, 620 Kbytes of flexible SRAM, and 32 x 32 Kbytes of cache with Flex ECC. The STM32H7R7/S7 line supports high speed external memory interfaces with XiP and is offered in 5 different packages to achieve the best performance at the lowest cost. The dedicated graphics line enables MPU-like GUIs thanks to NeoChrom GPU, JPEG codec, and LTDC, with minimum CPU interventions.

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TE Connectivity

Product：LGA4677 Socket

Recommended reasons： Key Benefits • Delivers an aggregate link bandwidth of 128 Gigabits per second in x16 configuration. Supports higher speed networking protocols and higher speed interconnections between system devices • With DDR5 8-Channel support, LGA 4677 socket provides increased performance and reduced overall power consumption that leads to cost savings • Greater number of memory channels enable speed intensive applications such as artificial intelligence and machine learning • When partnered with TE Connectivity (TE) DDR5 DIMM Socket solutions and PCIe Generation 5 (Gen 5), LGA 4677 socket provides a total solution for supporting the data rates required by next generation system architectures • Supports auto-assembly processes to facilitate ease of installation and limit possibility of rework Target Application • Servers • Communications Equipment • Workstations • Storage • Embedded System • Desktop PCs • Instrument Equipment

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XMOS

Product：XMOS xcore^®-voice complete intelligent voice solution

Recommended reasons：

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ArtInChip

Product：Industrial-grade Display and Control Integrated Cross-border MCU D13x Series

Recommended reasons： Main Features: Multimedia Processing: Equipped with a dedicated 2D graphics acceleration engine, supporting JPEG encoding and decoding, PNG hardware decoding, and 1080P@30fps video input. Display Output: Supports RGB888/LVDS/MIPI-DSI, with the highest resolution of 1366x768@60fps. Memory: Integrated NorFlash (2MB-16MB), SPINand (64MB-128MB), and PSRAM (32MB). Connectivity: Supports Ethernet EMAC, HS-USB, multiple UARTs, SPI, and CANBus. Security: Built-in SPICrypto and Crypto Engine. Application Fields include industrial HMI, gateways, serial port screens, smart home, mobile screen control terminals, and home appliance HMI. Key Advantages: High performance. Support for multiple interfaces. High-resolution display. Strong multimedia processing capabilities. Enhanced security. Competitive Advantages: Fully domestically manufactured, with advantages in supply chain stability and cost. Industrial-grade quality, offering higher reliability and stability. Powerful multimedia processing capabilities stand out compared to competitors. A wide range of application fields, from industrial to consumer electronics, ensuring strong market adaptability.

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GUANGDONG JIDE PRECISION ELECTRONICS CO., LTD

Product：HT150 12P Through Wall Connector

Recommended reasons： DHT Through Wall Connector is used for Hybrid Transmission or Engine Cylinders electrical connection systems. It’s a type of high reliability connector which could achieve high temperature resistance, oil resistance, vibration resistance, high operating life and also could greatly simplify the transmission cylinders design and assembly. Applications of the product The global new energy vehicle market has seen a significant increase in sales of hybrid vehicles due to their low initial costs, lack of range anxiety, and increased market recognition. The transmission and engine of hybrid vehicles require the integration of more oil&electric sensors and communication control signals. As many conductive wiring harnesses as possible are led out from the cylinders, manual assembly is inconvenient. Due to the special environment inside the cylinders (such as high temperature/oil/vibration), the reliability requirements of the working environment are very high. The through cylinder block connector solves these operational and reliability problems; The through cylinder connector is a connector that passes through the cylinder body of a transmission or engine to achieve electrical connection between the inside and outside. It is easy to assemble on the assembly line of transmission or engine assembly plant.

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SigmaStar Technology Inc.（SigmaStar)

Product：SigmaStar's All-in-One AI Chip SSU9386

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