Startup of the Year-2024 World Electronics Achievement Awards-EE Times

GravityXR Electronics and Technology Co., Ltd

Recommended reasons： GravityXR Electronics and TechnologyCo., Ltd. is committed to the research and development of core technologies in the field of XR (VR/MR/AR), with GravityXR™ bionic vision chip as the carrier, hardware technology and algorithm as the support, providing complete technical solutions for the next generation XR personal computing platform and mobile terminal. The founding team members all graduated from world-class universities; At the same time, they have rich industry experience, have held important positions in the research and development of cutting-edge technologies in high-tech companies around the world, and has deep accumulation in semiconductor, display, perception, image vision, and XR related industry. The company has completed 1 billion yuan in financing since its establishment. Well-known shareholders include Gaorong Capital, Sequoia Capital, IDG Capital, Goertek, MiHoYo, 37 Interactive Entertainment, etc.

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MetaSilicon

Recommended reasons： Since its establishment in 2021, MetaSilicon has rapidly emerged as a bright star in the field of chip design. We are deeply involved in cutting-edge technologies such as end-side AI, high-precision ADC, computational optics and stacking sensor, and create AI-accelerated next-generation CMOS image sensor chips (CIS) for the automotive, medical, industrial, AR & VR and other industries. In just two years, MetaSilicon has made a breakthrough in launching a CIS product matrix covering 5M and 8M for mobile phones and 1.3M and 3M for automobiles, and successfully achieved mass production of the first product in 2023, demonstrating the company's strong R&D strength and efficiency. Our core team brings together elites with more than 18 years of chip design experience to provide a solid backing for technological innovation. It is particularly worth mentioning that the company's independently developed LOFIC+DCG HDR® Technology can combine high gain and low gain dual images in a single exposure, increasing the dynamic range of CIS imaging to 140dB, which can better meet the needs of high-end ADAS/ AD system's strict requirements for high HDR ensure the safety of intelligent driving.

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Transchip Technology (Nanjing) Co., Ltd

Recommended reasons： System on Chip (SoC) has become the mainstream direction for the design of large-scale integrated circuit systems, thanks to its high integration, low power consumption, and cost-effectiveness. Network on Chip (NoC) is a bus network that connects various modules such as CPU/GPU/Video/DDR, as well as peripherals, to form the SoC. Transchip's Network on Chip Subsystem can help chip design companies reduce power consumption, enhance performance, and accelerate SoC development, thereby reducing the costs of development and production.

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Witmem

Recommended reasons： Witmem is a global leader in CIM（computing-in-memory）chip, focusing on AI application scenarios and committed to promoting the commercialization and mass production of CIM technology. With disruptive technological innovation, the company has overcome the limitations of traditional computing architectures by integrating storage and computation physically, significantly reducing data movement and greatly enhancing AI computational efficiency. In 2022, Witmem launched the world's first large-scale mass-produced CIM chip, the WTM2101, which has been widely applied in the fields of intelligent voice recognition and AI health monitoring, demonstrating excellent computational power and power consumption advantages. Currently, the company's self-developed edge computing chip series, WTM-8, is about to enter mass production, expected to provide at least 24Tops of computational power while consuming only 10% of the power of similar market solutions, greatly promoting the performance improvement of mobile devices in image processing and spatial computing. Since its establishment in 2017, Witmem has received continuous support from several leading technology companies and top financial investment institutions. Looking forward,Witmem will continue to enhance AI computational power and improve its ecosystem, providing a solid foundation for the popularization and application of AI technology.

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Wuxi HippStor Technology Co., Ltd

Recommended reasons： HippStor Technology Co., Ltd. was Founded in May 2023, focusing on the research and development, production, and sales of enterprise-level storage products. In the past year, we have rapidly released products under the "HippStor" brand, such as HP600 NVMe SSD, DDR4/DDR5 RDIMM, and ECC SODIMM, to provide high-performance, highly reliable, and low-power storage solutions for Database, Artificial Intelligence, and Cloud enterprise applications. 1. The company's proprietary SSD Performance Acceleration Technology (PAT) has broken through the performance bottleneck of the PCIe Gen4 interface, making the HP600 NVMe SSD the best performing product in the PCIe Gen4 SSD market, and even some performance indicators have reached the level of PCIe Gen5; 2. Due to the widespread use of consumer-grade DRAM IC in the ECC SODIMM product market, the reliability cannot meet the needs of Cloud core data switching. Therefore, HippStor ECC SODIMMs adopt a highly reliable enterprise-grade DRAM IC to fill the market gap and meet the needs of Cloud business.

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CHIPEASY TECHNOLOGY （SHANGHAI） LIMITED

Recommended reasons： basic instruction set and is described in the C language. It enables engineers to explore computing architecture trade-off, optimize PPA, and deliver optimized designs for compute intensive applications. The DSA design paradigm integrated into “FARMStudio” is applicable to a broad spectrum of compute intensive domains such as computer vision,AI, video, audio, industrial control, and etc,. This enables design house to develop their own customized DSA cores quickly and eﬃciently, thereby enables differentiated chip designs. FARMStudio tool is the best-in-class EDA tool for DSA processor designs: 1. C based design input language for DSA that is easy to understand and broadly used by algorithm engineers/architects/design engineers, as compared with traditional HDL inputs currently used; 2. RISC-V compliant DSA processors that are compliant to open-source standard and cater towards custom algorithm needs; 3. Integrated design and verification environment for DSA makes collaboration easy and significantly reduces design cycle time. 4. For the first time, algorithm and hardware design engineers can work collaboratively in the same integrated development interface. This breakthrough will enable a new wave of innovative designs.

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MEMS Drive Nanjing Limited

Recommended reasons： The MEMS autofocus (AF) actuator is a piezoelectric multi-morphic thin film actuator, and it can move at Z and tip-tilt directions to achieve the 3 axis compensation. The MEMS devices are designed to be based on standard Silicon fabrication processes and hence have good scalability and ease of handling, testing and packaging relatively. There are multiple advantages of this sensor-based technology. It provides 3-axis image adjustments (Z, tip and tilt) compared to 1-axis counterpart on lens-based AF systems. It also moves 3 times faster and 10 times more precisely by detecting vibrations of less than a pixel compared to 3-5 micrometers on lens-based AF. And finally, by not using a motor to move the lens around, it consumes up to 50 times less power and avoids heating problems that could affect the image's quality. In automotive applications, continuous vibrations during driving can result in blurry images, and environmental factors such as temperature and humidity can deform cameras, further degrading video quality. MEMS AF technology addresses this issue by providing an auto-focus (AF) solution that enhances image clarity and stability, meeting the rigorous quality standards required for automotive safety in Advanced Driver Assistance Systems (ADAS). MEMS piezo autofocus technology is also transforming mobile phone and AR/VR camera systems. MEMS technology enhances the performance by providing quick and precise adjustments to the camera modules. This ensures precise focus and maximum visual clarity, significantly improving the overall user experience. The reduced power consumption of MEMS actuators also mitigates heating issues, enhancing device performance and longevity.

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Calculet semiconductor technologies, Co., Ltd

Recommended reasons： Calculet Semiconductor is an innovative supplier of AI chiplets, aiming to provide novel AI computational support with its international leadership in multimodal AI processor design technology and chiplet design methodologies. General-Purpose High-Performance AI Chiplets supports both traditional CNN algorithms and multimodal large model algorithms. Based on AI chiplet technology, the company will introduce related products, including chiplets, modules, and boards, to provide AI computational support for different application scenarios such as intelligent cockpits, robotics, and pan-consumer electronics. Leveraging its advanced, general-purpose multimodal AI computational core architecture, Calculet Semiconductor has achieved a harmonious balance between algorithmic compatibility and computational efficiency. The company's unique AI computational power fusion technology, CalFusion, support multi-level, flexible, and transparent fusion and expansion of computing cores. Users can easily utilize multiple CalCore chiplets or chips for stacking and extension on package substrate or PCB. This enables the construction of AI solutions with varying computational powers, meeting diverse requirements of function and cost from different AI application scenarios.

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Suzhou Yizhu Intelligent Technology Co., Ltd.

Recommended reasons： Yizhu Technology has the following advantages: CIM architecture innovation, ReRAM new memristor application innovation, all-digital technique path application innovation, CIM ultra-heterogeneous system-level innovation and a strong professional team lineup. Yizhu breaks through the bottlenecks such as "storage wall", "energy efficiency wall" and "compilation wall" brought by the traditional von · Neumann architecture through CIM architecture innovation, which is very suitable for AI parallel computing.Due to its strong feasibility and extremely high ceiling for development of computing power, it can be said to be a computing architecture born for AI calculations. Compared to domestic and international CIM companies, RRAM chosen by Yizhu has advantages such as low power consumption, high computational accuracy, high energy efficiency, and compatibility with CMOS manufacturing processes. Moreover, it is now based on mature processes, and there is mass production in China, making it the most suitable storage device for AI with high computing power in memory-computing integration. RRAM has also been included in the product roadmaps of most domestic and international CIM enterprises. At the same time, Yizhu adopts a fully digital technical route for memory-computing integrated chips, which can ensure that the entire computation process is not affected by the process and working environment, without loss of accuracy, and without the performance and energy efficiency issues caused by analog/digital or digital/analog conversions, or problems with excessive wafer area.

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Pimchip Technology

Recommended reasons： Pimchip Technology is a pioneering company of processing-in-memory (PIM) technology bringing a vision that the universe can be better perceived by AI computing. The PIM technology, combining processors and data storage, revolutionizes the computing architecture paradigms by breaking through the inherent limitations of traditional chip architecture (Von Neumann), known as “memory wall” problem, and hence enables high-performance AI computing engines at low cost. The PIM chips allow computationally demanding machine learning algorithms to run on local devices, while enjoy lower power consumption and smaller size than Von-Neumann based chips. Not limited to AI, PIM in fact can be tailored to accelerate any given tensor/vector calculation. AI acceleration units and chips developed by Pimchip Technology based on SRAM processing-in-memory technology. PIMCHIP-N300 is a new processing-in-memory neural network processing unit (NPU) that provides a dedicated acceleration core for machine learning and artificial intelligence fields. It processes machine learning algorithms such as artificial neural networks and deep learning models with higher efficiency and lower energy consumption, facilitating the implementation of AI in multiple scenarios; PIMCHIP-S300 specifically used in intelligent perception and decision-making, The demonstrated high computation efficiency beats the current GPU solutions by at least an order of magnitude. Beyond, Pimchip offers customized solutions to accelerate the construction of universe perception, opening a new eco-system in the era of AI.

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GUANGDONG JIDE PRECISION ELECTRONICS CO., LTD

Recommended reasons： DHT Through Wall Connector is used for Hybrid Transmission or Engine Cylinders electrical connection systems. It’s a type of high reliability connector which could achieve high temperature resistance, oil resistance, vibration resistance, high operating life and also could greatly simplify the transmission cylinders design and assembly. Technical Parameters Vibration/Mechanical Shock Grade V5 (GMW 3191) Thermal Shock USCAR-2 5.6.1.3 100 cycles -40℃~140℃ Temperature & Humidity cycle USCAR-2 5.6.2.3 -40℃~140℃ 0%~95% RH High temperature aging 963小时 125℃ 41小时 132℃ 4小时 140℃℃ Soak Test 140℃ for 2 hours Depth 30-40cm for 30 minutes Pressure/vacuum leakage Original Value :48kPa After Environmental test :28kPa High Pressure Spray 8000Kpa,80°C The global new energy vehicle market has seen a significant increase in sales of hybrid vehicles due to their low initial costs, lack of range anxiety, and increased market recognition. The transmission and engine of hybrid vehicles require the integration of more oil&electric sensors and communication control signals. As many conductive wiring harnesses as possible are led out from the cylinders, manual assembly is inconvenient. Due to the special environment inside the cylinders (such as high temperature/oil/vibration), the reliability requirements of the working environment are very high. The through cylinder block connector solves these operational and reliability problems; The through cylinder connector is a connector that passes through the cylinder body of a transmission or engine to achieve electrical connection between the inside and outside. It is easy to assemble on the assembly line of transmission or engine assembly plant. Applications：DHT Transmission、Engine、Drive Motor

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Bontec Raysemi Semiconductor Technology (Suzhou) Co., Ltd

Recommended reasons： Bontec Raysemi Semiconductor Technology (Suzhou) Co., Ltd， Equipment manufacturers, system solution providers, and testing service providers in the field of power semiconductor and wide bandgap semiconductor testing。From the independent research and development of core high-power SMUs (sources, meters) to system architecture, we aim to fill the gap in the field of high-end semiconductor testing equipment in China, achieve import substitution, solve the bottleneck problem, and provide testing and analysis technology means and services for production, academia, research, and application.Using advanced testing and analysis technology to support global semiconductor technology innovation and development 1.Leader - Qiu Yufeng, former director of State Grid Intelligent Grid Research Institute Leading the 02 special project "Optimization Research on Crimp IGBT Devices for DC Power Grid Equipment" Leading the national key project "Fundamental Theoretical Research on Silicon Carbide High Power Electronic Devices and Their Applications" 2.Leading Enterprise - The First Batch of Semiconductor Leading Enterprises to Move into Suzhou Nanocity 3. Core team - composed of technical personnel from Shide Technology, well-known domestic semiconductor companies, and well-known wide bandgap semiconductor R&D members in the industry 4. Technical background - Over 20 years of testing experience at the national network level 5. Intelligent Four Quadrant SMU -3KV/2.2KA Capability ---10fA measurement resolution ---PA level leakage measurement accuracy 6. System Advantage - Diversified System Customization

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