Since its establishment in 2021, MetaSilicon has rapidly emerged as a bright star in the field of chip design. We are deeply involved in cutting-edge technologies such as end-side AI, high-precision ADC, computational optics and stacking sensor, and create AI-accelerated next-generation CMOS image sensor chips (CIS) for the automotive, medical, industrial, AR & VR and other industries.
In just two years, MetaSilicon has made a breakthrough in launching a CIS product matrix covering 5M and 8M for mobile phones and 1.3M and 3M for automobiles, and successfully achieved mass production of the first product in 2023, demonstrating the company's strong R&D strength and efficiency. Our core team brings together elites with more than 18 years of chip design experience to provide a solid backing for technological innovation.
It is particularly worth mentioning that the company's independently developed LOFIC+DCG HDR^® Technology can combine high gain and low gain dual images in a single exposure, increasing the dynamic range of CIS imaging to 140dB, which can better meet the needs of high-end ADAS/ AD system's strict requirements for high HDR ensure the safety of intelligent driving.