C-mount packages Used for lasers and laser-based systems, laser measurement and control, precision optics. Typical wavelength is from 680nm to 980nm, with output power rating up to 7W.
2. TO3 package The number of pins is up to 6 or 8. The base material is either CRS or CuW.
3. VCSEL sub-module package
The vertical-cavity surface-emitting diode lasers are becoming popular during past three decades, due to its low cost and high reliability. They are a great choice for short range data communications and networks. Their output power and wavelength vary depending on application requirements. Shown below on the right is the architecture of a VCSEL, the P-contact is a submount that is usually made of heatsink materials that have high thermal conductivity and close CTE match tothe CTE of the GaAs die substrate, such as CuW, CuMo.
4. BTF (Butterfly) package
Butterfly packages is the standard format for optical Telecom transmissions and laser diode pumps. Below is a typical 14 pin butterfly package, in which the laser die sits on AlN submount. The AlN submount is mounted on a TEC, which is attached to a baseplate that is made of CuW, Kovar, or CuMo.
5. Mini-DIL package
7. HHL Package HHL or High Heat Load packages are the largest standard laser diode packages available. They are designed for high power diode laser applications, and usually have 9 pins. The base material can be various: kovar, CuW, or CuMo.
10. CCP stacks (G-mount) Applications: The high output power is suitable for applications such as military uses, rangefinding, sensing, and medical applications. Typical wavelength: 808nm, 880nm, 885nm, 940nm Output power: 20W (CW), 100-5200W (pulsed) Below is the architecture of Coherent’s Vertical diode laser array. Each diode bar is soldered to the CuW submount with AuSn solder on the P-side. N-side is connected with indium solder.
11. Microchannel cooled package (MCCP) Application: The high output power achieved by these packages can be used in laser pumping, military (rangefinding, light detecting), or medical applications. Typical wavelength: 806-808nm, 880nm, 980nm Output Power: 100-900W Due to excellent thermal and electrical conduction of the CuW submount, and close CTE match with die material GaAs. The MCC package allows stacking of several high power laser diodes in an array using gold/tin solder, and the sub-assembly is then cooled using water cooling channels, as shown below.
