各种IC封装形式图片

芯片工艺技术 2021-11-30 18:02 1563浏览 0评论 1点赞

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收集了大部分IC封装的实物图片，供大家日常查阅

	BGA Ball Grid Array
	EBGA 680L
	LBGA 160L
	PBGA 217L Plastic Ball Grid Array
	SBGA 192L
	TSBGA 680L
	CLCC
	CNR Communication and Networking Riser Specification Revision 1.2
	CPGA Ceramic Pin Grid Array
	DIP Dual Inline Package
	DIP-tab Dual Inline Package with Metal Heatsink
	FBGA
	FDIP
	FTO220
	Flat Pack
	HSOP28
	ITO220
	ITO3p
	JLCC
	LCC
	LDCC
	LGA
	LQFP
	PCDIP
	PGA Plastic Pin Grid Array
	PLCC 详细规格
	PQFP
	PSDIP
	LQFP 100L 详细规格
	METAL QUAD 100L 详细规格
	PQFP 100L 详细规格
	QFP Quad Flat Package
	SOT220
	SOT223
	SOT223
	SOT23
	SOT23/SOT323
	SOT25/SOT353
	SOT26/SOT363
	SOT343
	SOT523
	SOT89
	SOT89
	Socket 603 Foster
	LAMINATE TCSP 20L Chip Scale Package
	TO252
	TO263/TO268
	SO DIMM Small Outline Dual In-line Memory Module
	SOCKET 370 For intel 370 pin PGA Pentium III & Celeron CPU
	SOCKET 423 For intel 423 pin PGA Pentium 4 CPU
	SOCKET 462/SOCKET A For PGA AMD Athlon & Duron CPU
	SOCKET 7 For intel Pentium & MMX Pentium CPU

	QFP Quad Flat Package
	TQFP 100L
	SBGA
	SC-70 5L
	SDIP
	SIP Single Inline Package
	SO Small Outline Package

	SOJ 32L
	SOJ
	SOP EIAJ TYPE II 14L
	SOT220
	SSOP 16L
	SSOP
	TO18
	TO220
	TO247
	TO264
	TO3
	TO5
	TO52
	TO71
	TO72
	TO78
	TO8
	TO92
	TO93
	TO99
	TSOP Thin Small Outline Package
	TSSOP or TSOP II Thin Shrink Outline Package
	uBGA Micro Ball Grid Array
	uBGA Micro Ball Grid Array

	ZIP Zig-Zag Inline Package
TEPBGA 288L	TEPBGA
	C-Bend Lead
	CERQUAD Ceramic Quad Flat Pack 详细规格
	Ceramic Case
	LAMINATE CSP 112L Chip Scale Package 详细规格
	Gull Wing Leads
	LLP 8La 详细规格
	PCI 32bit 5V Peripheral Component Interconnect 详细规格
	PCI 64bit 3.3V
	PCMCIA
	PDIP
	PLCC 详细规格
	SIMM30 Single In-line Memory Module
	SIMM72 Single In-line Memory Module
	SIMM72 Single In-line
	SLOT 1 For intel Pentium II Pentium III & Celeron CPU
	SLOT A For AMD Athlon CPU
	SNAPTK
	SNAPTK
	SNAPZP
	SOH