12月3日消息,美国商务部工业和安全局(BIS)发布了出口管制的“强化版”新规,将140个中国半导体行业相关实体添加到“实体清单”,妄图进一步限制中国人工智能和先进半导体的发展。
据悉,这次新规主要有两份文件,第一份是152页的临时最终规则(IFR,Interim final rule),BIS对出口管理条例(EAR)的某些管控进行了调整,涉及先进计算物、超级计算机以及半导体制造设备。
第二份是58页的最终规则(Final rule),名为《实体清单的新增与修改及从验证终端用户(VEU)计划中移除》。该规则通过新增和修改实体清单,对某些关键技术进行管控。两份新规都在2024年12月2日当天生效。
根据当天BIS的公告,新的规则主要包括5个方向:对24种半导体制造设备和3种用于开发或生产半导体的软件工具实施新的管制;对高带宽存储器(HBM)实施新的管制;针对合规和转移问题的新的“红旗警告”(Red flag guidance,相当于强化预警,防止规避出口政策);
在“实体清单”中新增加140个名单并进行14项修改,涵盖中国设备制造商、半导体晶圆厂和投资公司;以及几项关键的监管变化,以增强先前管制的有效性。
这份声明不加掩饰地指出,其宣布的所有政策变化都是为了限制中国自主生产先进技术的能力,延缓中国开发人工智能的能力、削弱中国本地化先进半导体生态系统。芯片霸权之心昭然若揭。
美国商务部的目标和野心很明确,深入到关键的半导体设备制造环节,以及当前AI芯片市场的关键产能瓶颈——存储芯片HBM,同时对EDA等软件工具围追截堵,继续全产业链“封锁”。
外交部回应
12月2日,外交部发言人林剑主持例行记者会。有记者提问,据报道,美方正在准备出台新一轮对华半导体出口限制措施,请问中方对此有何回应?
林剑表示,我们已多次就这个问题表明过立场。中方一贯坚决反对美方泛化国家安全概念,滥用出口管制的措施,对中国进行恶意封锁和打压,这种行为严重违反市场经济规律和公平竞争的原则,破坏国际经贸秩序,扰乱全球产供链的稳定,最终损害的是所有国家的利益。他强调,中方将采取坚决措施,坚定维护中国企业的正当合法权益。
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