PCB专业英译术语
一、综合词汇
1、印制电路：printed circuit
2、印制线路：printed wiring
3、印制板：printed board
4、印制板电路：printed circuit board (PCB)
5、印制线路板：printed wiring board(PWB)
6、印制组件：printed component
7、印制接点：printed contact
8、印制板装配：printed board assembly
9、板：board
10、单面印制板：single-sided printed board(SSB)
11、双面印制板：double-sided printed board(DSB)
12、多层印制板：mulitlayer printed board(MLB)
13、多层印制电路板：mulitlayer printed circuit board
14、多层印制线路板：mulitlayer prited wiring board
15、刚性印制板：rigid printed board
16、刚性单面印制板：rigid single-sided printed borad
17、刚性双面印制板：rigid double-sided printed borad
18、刚性多层印制板：rigid multilayer printed board
19、挠性多层印制板：flexible multilayer printed board
20、挠性印制板：flexible printed board
21、挠性单面印制板：flexible single-sided printed board
22、挠性双面印制板：flexible double-sided printed board
23、挠性印制电路：flexible printed circuit (FPC)
24、挠性印制线路：flexible printed wiring
25、刚性印制板：flex-rigid printed board, rigid-flex printed board
26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板：flush printed board
29、金属芯印制板：metal core printed board
30、金属基印制板：metal base printed board
31、多重布线印制板：mulit-wiring printed board
32、陶瓷印制板：ceramic substrate printed board
33、导电胶印制板：electroconductive paste printed board
34、模塑电路板：molded circuit board
35、模压印制板：stamped printed wiring board
36、顺序层压多层印制板：sequentially-laminated mulitlayer
37、散线印制板：discrete wiring board
38、微线印制板：micro wire board
39、积层印制板：buile-up printed board
40、积层多层印制板：build-up mulitlayer printed board (BUM)
41、积层挠印制板：build-up flexible printed board
42、表面层合电路板：surface laminar circuit (SLC)
43、埋入凸块连印制板：B2it printed board
44、多层膜基板：multi-layered film substrate(MFS)
45、层间全内导通多层印制板：ALIVH multilayer printed board
46、载芯片板：chip on board (COB)
47、埋电阻板：buried resistance board
48、母板：mother board
49、子板：daughter board
50、背板：backplane
51、裸板：bare board
52、键盘板夹心板：copper-invar-copper board
53、动态挠性板：dynamic flex board
54、静态挠性板：static flex board
55、可断拼板：break-away planel
56、电缆：cable
57、挠性扁平电缆：flexible flat cable (FFC)
58、薄膜开关：membrane switch
59、混合电路：hybrid circuit
60、厚膜：thick film
61、厚膜电路：thick film circuit
62、薄膜：thin film
63、薄膜混合电路：thin film hybrid circuit
64、互连：interconnection
65、导线：conductor trace line
66、齐平导线：flush conductor
67、传输线：transmission line
68、跨交：crossover
69、板边插头：edge-board contact
70、增强板：stiffener
71、基底：substrate
72、基板面：real estate
73、导线面：conductor side
74、组件面：component side
75、焊接面：solder side
76、印制：printing
77、网格：grid
78、图形：pattern
79、导电图形：conductive pattern
80、非导电图形：non-conductive pattern
81、字符：legend
82、标志：mark
二、基材
1、基材：base material
2、层压板：laminate
3、覆金属箔基材：metal-clad bade material
4、覆铜箔层压板：copper-clad laminate (CCL)
5、单面覆铜箔层压板：single-sided copper-clad laminate
6、双面覆铜箔层压板：double-sided copper-clad laminate
7、复合层压板：composite laminate
8、薄层压板：thin laminate
9、金属芯覆铜箔层压板：metal core copper-clad laminate
10、金属基覆铜层压板：metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、基体材料：basis material
13、预浸材料：prepreg
14、粘结片：bonding sheet
15、预浸粘结片：preimpregnated bonding sheer
16、环氧玻璃基板：epoxy glass substrate
17、加成法用层压板：laminate for additive process
18、预制内层覆箔板：mass lamination panel
19、内层芯板：core material
20、催化板材：catalyzed board ,coated catalyzed laminate
21、涂胶催化层压板：adhesive-coated catalyzed laminate
22、涂胶无催层压板：adhesive-coated uncatalyzed laminate
23、粘结层：bonding layer
24、粘结膜：film adhesive
25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film
26、无支撑胶粘剂膜：unsupported adhesive film
27、覆盖层：cover layer (cover lay)
28、增强板材：stiffener material
29、铜箔面：copper-clad surface
30、去铜箔面：foil removal surface
31、层压板面：unclad laminate surface
32、基膜面：base film surface
33、胶粘剂面：adhesive faec
34、原始光洁面：plate finish
35、粗面：matt finish
36、纵向：length wise direction
37、模向：cross wise direction
38、剪切板：cut to size panel
39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49、超薄型层压板：ultra thin laminate
50、陶瓷基覆铜箔板：ceramics base copper-clad laminates
51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates
三、基材的材料
1、A阶树脂：A-stage resin
2、B阶树脂：B-stage resin
3、C阶树脂：C-stage resin
4、环氧树脂：epoxy resin
5、酚醛树脂：phenolic resin
6、聚酯树脂：polyester resin
7、聚酰亚胺树脂：polyimide resin
8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin
9、丙烯酸树脂：acrylic resin
10、三聚氰胺甲醛树脂：melamine formaldehyde resin
11、多官能环氧树脂：polyfunctional epoxy resin
12、溴化环氧树脂：brominated epoxy resin
13、环氧酚醛：epoxy novolac
14、氟树脂：fluroresin
15、硅树脂：silicone resin
16、硅烷：silane
17、聚合物：polymer
18、无定形聚合物：amorphous polymer
19、结晶现象：crystalline polamer
20、双晶现象：dimorphism
21、共聚物：copolymer
22、合成树脂：synthetic
23、热固性树脂：thermosetting resin
24、热塑性树脂：thermoplastic resin
25、感旋光性树脂：photosensitive resin
26、环氧当量：weight per epoxy equivalent (WPE)
27、环氧值：epoxy value
28、双氰胺：dicyandiamide
29、粘结剂：binder
30、胶粘剂：adesive
31、固化剂：curing agent
32、阻燃剂：flame retardant
33、遮光剂：opaquer
34、增塑剂：plasticizers
35、不饱和聚酯：unsatuiated polyester
36、聚酯薄膜：polyester
37、聚酰亚胺薄膜：polyimide film (PI)
38、聚四氟乙烯：polytetrafluoetylene (PTFE)
39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
40、增强材料：reinforcing material
41、玻璃纤维：glass fiber
42、E玻璃纤维：E-glass fibre
43、D玻璃纤维：D-glass fibre
44、S玻璃纤维：S-glass fibre
45、玻璃布：glass fabric
46、非织布：non-woven fabric
47、玻璃纤维垫：glass mats
48、纱线：yarn
49、单丝：filament
50、绞股：strand
51、纬纱：weft yarn
52、经纱：warp yarn
53、但尼尔：denier
54、经向：warp-wise
55、纬向：weft-wise, filling-wise
56、织物经纬密度：thread count
57、织物组织：weave structure
58、平纹组织：plain structure
59、坏布：grey fabric
60、稀松织物：woven scrim
61、弓纬：bow of weave
62、断经：end missing
63、缺纬：mis-picks
64、纬斜：bias
65、折痕：crease
66、云织：waviness
67、鱼眼：fish eye
68、毛圈长：feather length
69、厚薄段：mark
70、裂缝：split
71、捻度：twist of yarn
72、浸润剂含量：size content
73、浸润剂残留量：size residue
74、处理剂含量：finish level
75、浸润剂：size
76、偶联剂：couplint agent
77、处理织物：finished fabric
78、聚酰胺纤维：polyarmide fiber
79、聚酯纤维非织布：non-woven polyester fabric
80、浸渍绝缘纵纸：impregnating insulation paper
81、聚芳酰胺纤维纸：aromatic polyamide paper
82、断裂长：breaking length
83、吸水高度：height of capillary rise
84、湿强度保留率：wet strength retention
85、白度：whitenness
86、陶瓷：ceramics
87、导电箔：conductive foil
88、铜箔：copper foil
89、电解铜箔：electrodeposited copper foil (ED copper foil)
90、压延铜箔：rolled copper foil
91、退火铜箔：annealed copper foil
92、压延退火铜箔：rolled annealed copper foil (RA copper foil)
93、薄铜箔：thin copper foil
94、涂胶铜箔：adhesive coated foil
95、涂胶脂铜箔：resin coated copper foil (RCC)
96、复合金属箔：composite metallic material
97、载体箔：carrier foil
98、殷瓦：invar
99、箔（剖面）轮廓：foil profile
100、光面：shiny side
101、粗糙面：matte side
102、处理面：treated side
103、防锈处理：stain proofing
104、双面处理铜箔：double treated foil
四、设计
1、原理图：shematic diagram
2、逻辑图：logic diagram
3、印制线路布设：printed wire layout
4、布设总图：master drawing
5、可制造性设计：design-for-manufacturability
6、计算机辅助设计：computer-aided design.(CAD)
7、计算机辅助制造：computer-aided manufacturing.(CAM)
8、计算机集成制造：computer integrat manufacturing.(CIM)
9、计算机辅助工程：computer-aided engineering.(CAE)
10、计算机辅助测试：computer-aided test.(CAT)
11、电子设计自动化：electric design automation .(EDA)
12、工程设计自动化：engineering design automaton .(EDA2)
13、组装设计自动化：assembly aided architectural design. (AAAD)
14、计算机辅助制图：computer aided drawing
15、计算机控制显示：computer controlled display .(CCD)
16、布局：placement
17、布线：routing
18、布图设计：layout
19、重布：rerouting
20、模拟：simulation
21、逻辑模拟：logic simulation
22、电路模拟：circit simulation
23、时序模拟：timing simulation
24、模块化：modularization
25、布线完成率：layout effeciency
26、机器描述格式：machine descriptionm format .(MDF)
27、机器描述格式数据库：MDF databse
28、设计数据库：design database
29、设计原点：design origin
30、优化（设计）：optimization (design)
31、供设计优化坐标轴：predominant axis
32、表格原点：table origin
33、镜像：mirroring
34、驱动文件：drive file
35、中间文件：intermediate file
36、制造文件：manufacturing documentation
37、队列支撑数据库：queue support database
38、组件安置：component positioning
39、图形显示：graphics dispaly
40、比例因子：scaling factor
41、扫描填充：scan filling
42、矩形填充：rectangle filling
43、填充域：region filling
44、实体设计：physical design
45、逻辑设计：logic design
46、逻辑电路：logic circuit
47、层次设计：hierarchical design
48、自顶向下设计：top-down design
49、自底向上设计：bottom-up design
50、线网：net
51、数字化：digitzing
52、设计规则检查：design rule checking
53、走（布）线器：router (CAD)
54、网络表：net list
55、计算机辅助电路分析：computer-aided circuit analysis
56、子线网：subnet
57、目标函数：objective function
58、设计后处理：post design processing (PDP)
59、交互式制图设计：interactive drawing design
60、费用矩阵：cost metrix
61、工程图：engineering drawing
62、方块框图：block diagram
63、迷宫：moze
64、组件密度：component density
65、巡回售货员问题：traveling salesman problem
66、自由度：degrees freedom
67、入度：out going degree
68、出度：incoming degree
69、曼哈顿距离：manhatton distance
70、欧几里德距离：euclidean distance
71、网络：network
72、阵列：array
73、段：segment
74、逻辑：logic
75、逻辑设计自动化：logic design automation
76、分线：separated time
77、分层：separated layer
78、定顺序：definite sequenc
五、形状与尺寸
1、导线（信道）：conduction (track)
2、导线（体）宽度：conductor width
3、导线距离：conductor spacing
4、导线层：conductor layer
5、导线宽度/间距：conductor line/space
6、第一导线层：conductor layer No.1
7、圆形盘：round pad
8、方形盘：square pad
9、菱形盘：diamond pad
10、长方形焊盘：oblong pad
11、子弹形盘：bullet pad
12、泪滴盘：teardrop pad
13、雪人盘：snowman pad
14、V形盘：V-shaped pad
15、环形盘：annular pad
16 、非圆形盘：non-circular pad
17、隔离盘：isolation pad
18、非功能连接盘：monfunctional pad
19、偏置连接盘：offset land
20、腹（背）裸盘：back-bard land
21、盘址：anchoring spaur
22、连接盘图形：land pattern
23、连接盘网格阵列：land grid array
24、孔环：annular ring
25、组件孔：component hole
26、安装孔：mounting hole
27、支撑孔：supported hole
28、非支撑孔：unsupported hole
29、导通孔：via
30、镀通孔：plated through hole (PTH)
31、余隙孔：access hole
32、盲孔：blind via (hole)
33、埋孔：buried via hole
34、埋/盲孔：buried /blind via
35、任意层内部导通孔：any layer inner via hole (ALIVH)
36、全部钻孔：all drilled hole
37、定位孔：toaling hole
38、无连接盘孔：landless hole
39、中间孔：interstitial hole
40、无连接盘导通孔：landless via hole
41、引导孔：pilot hole
42、端接全隙孔：terminal clearomee hole
43、准表面间镀覆孔：quasi-interfacing plated-through hole
44、准尺寸孔：dimensioned hole
45、在连接盘中导通孔：via-in-pad
46、孔位：hole location
47、孔密度：hole density
48、孔图：hole pattern
49、钻孔图：drill drawing
50、装配图：assembly drawing
51、印制板组装图：printed board assembly drawing
52、参考基准：datum referan
六、流程
1、开料：CutLamination/Material cutting
2、钻孔：Drilling
3、内钻：Inner LayerDrilling
4、一次孔:Outer Layer Drilling
5、二次孔:2nd Drilling
6、雷射钻孔:Laser Drilling /Laser Ablation
7、盲(埋)孔钻孔:Blind & Buried Hole Drilling
8、干膜制程：PhotoProcess(D/F)/Dry Film
9、前处理 (Pretreatment)
10、压膜:Dry Film Lamination
11、曝光:Exposure
12、显影:Developing
13、去膜:Stripping
14、压合：Lamination
15、黑化:Black OxideTreatment
16、微蚀:Microetching
17、铆钉组合:eyelet
18、迭板:Lay up
19、压合:Lamination
20、后处理:Post Treatment
21、黑氧化:Black Oxide Removal
22、铣靶:spot face
23、去溢胶:resin flush removal
24、减铜：Copper Reduction
25、水平电镀：HorizontalElectrolytic Plating
26、电镀：Panel plating
27、锡铅电镀:Tin-Lead Plating /Pattern Plating
28、低于 1 mil: Less than 1 mil Thickness
29、高于 1 mil:More than 1 mil Thickness
30、砂带研磨:Belt Sanding
31、剥锡铅:Tin-Lead Stripping
32、微切片: Microsection
33、蚀铜:Etching
34、初检:Touch-up
35、塞孔：Plug Hole
36、防焊(绿漆/绿油)：SolderMask
37、C面印刷:Printing Top Side
38、S面印刷:Printing Bottom Side
39、静电喷涂:Spray Coating
40、前处理:Pretreatment
41、预烤:Precure
42、后烘烤:Postcure
43、印刷:Ink Print
44、表面刷磨:Scrub
45、后烘烤:Postcure
46、UV烘烤:UV Cure
47、文字印刷:Printing of Legend
48、喷砂:Pumice/Wet Blasting
49、印可剥离防焊/蓝胶:Peelable Solder Mask)
50、化学前处理,化学研磨：Chemical Milling
51、选择性浸金压膜：Selective Gold Dry Film Lamination
52、镀金：Gold plating
53、喷锡：Hot Air SolderLeveling
54、成型：Profile/Form
55、开短路测试：Electrical Testing
56、终检：Final VisualInspection
57、金手指镀镍金：Gold Finger
58、电镀软金：Soft Ni/Au Plating
59、浸镍金：Immersion Ni/Au / Electroless Ni/Au
60、喷锡:Hot Air Solder Leveling
61、水平喷锡:HorizontalHot Air Solder Leveling
62、垂直喷锡: Vertical Hot Air Solder Leveling
63、超级焊锡:Super Solder
64、印焊锡突点:Solder Bump
65、数控铣/锣板：N/C Routing/Milling
66、模具冲/啤板：Punch
67、板面清洗烘烤：Cleaning & Backing
68、V型槽/V-CUT：V-Cut/V-Scoring
69、金手指斜边：Beveling of G/F
70、短断路测试Electrical Testing/Continuity & Insulation Testing
71、AOI 光学检查：AOI Inspection
72、VRS 目检：Verified & Repaired
73、泛用型治具测试：Universal Tester
74、专用治具测试：Dedicated Tester
75、飞针测试：Flying Probe
76、终检：Final Visual Inspection
77、压板翘：Warpage Remove
78、X-OUT 印刷：X-Out Marking
79、包装及出货：Packing& shipping
80、清洗及烘烤：Final Clean & Baking
81、铜面保护剂：ENTEK Cu-106A/OSP
82、离子残余量测试:Ionic Contamination Test/ Cleanliness Test
83、冷热冲击试验:Thermal cycling Testing
84、焊锡性试验:Solderability Testing
85、雷射钻孔:Laser Ablation
86、雷射钻Tooling孔:Laser ablationTooling Hole
87、雷射曝光对位孔:Laser Ablation Registration Hole
88、雷射Mask制作:Laser Mask
89、雷射钻孔:Laser Ablation
90、AOI检查及VRS:AOI Inspection & Verified & Repaired
91、除胶渣:Desmear
92、专用治具测试:Dedicated Tester
93、飞针测试:Flying Probe
94、压板翘: Warpage Remove
95、底片：Ablation
96、烧溶：laser)
97、切/磨：abrade
98、粗化：abrasion
99、耐磨性：absorption resistance
100、允收:ACC /accept
101、加速腐蚀:accelerated corrosion test
102、加速试验:accelerated test
103、速化反应:acceleration
104、加速剂:accelerator
105、允许：acceptable
106、活化液：activator
107、实际在制品：active work in process
108、附着力：adhesion
109、黏着法：adhesive method
110、气泡:air inclusion
111、风刀：air knife
112、不定形的改变：amorphous change
113、总量：amount
114、硝基戊烷：amylnitrite
115、分析仪：analyzer
116、环状垫圈;孔环annular ring
117、阳极泥：anodeslime (sludge)
118、阳极清洗：anodizing
119、自动光学检测：AOI/automatic optical inspection
120、引用之文件：applicable documents
121、允收水平抽样：AQL sampling
122、液态光阻：aqueous photoresist
123、纵横比(厚宽比)：aspect ratioAs received
124、背光：back lighting
125、垫板：back-up
126、预留在制品：banked work in process
127、基材：base material
128、基准绩效：baseline performance
129、批：batch
130、贝他射线照射法：beta backscattering
131、切斜边;斜边：beveling
132、二方向之变形:biaxial deformation
133、黑化：black-oxide
134、空板：blank panel
135、挖空:blanking
136、弹开:blip
137、气泡:blister blistering
138、吹孔:blow hole
139、板厚错误:board-thickness error
140、黏结层:bonding plies
141、板弯:bow ; bowing
142、破空:break out
143、搭桥;桥接：bridging
144、接单生产：BTO (Build To Order)
145、烧焦：burning
146、毛边(毛头)：burr
147、碳化物：carbide
148、定位梢：carlson pin
149、载运剂：carrier
150、催化：catalyzing
151、阴极溅射法：catholicsputtering
152、隔板;钢板：caul plate
153、校验系统之各种要求：calibration system requirements
154、中心光束法：center beam method
155、集中式投射线：central projection
156、认证：certification
157、倒角 (金手指)：chamfer chamfer
158、切斜边;倒角：chamfering
159、特性阻抗：characteristic impedance
160、电量传递过电压：charge transfer overpotential
161、网框：chase
162、棋盘：checkboard
163、蟹和剂：chelator
164、化学键：chemical bond
165、化学蒸着镀：chemical vapor deposition
166、圆周性之孔破：circumferential void
167、包夹金属：clad metal
168、无尘室：clean room
169、间隙：clearance
170、表面处理：Coating/Surface Finish
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