综合词汇
| 印制电路 | printed circuit |
| 印制线路 | printed wiring |
| 印制板 | printed board |
| 印制板电路 | printed circuit board (PCB) |
| 印制线路板 | printed wiring board(PWB) |
| 印制元件 | printed component |
| 印制接点 | printed contact |
| 印制板装配 | printed board assembly |
| 板 | board |
| 单面印制板 | single-sided printed board(SSB) |
| 双面印制板 | double-sided printed board(DSB) |
| 多层印制板 | mulitlayer printed board(MLB) |
| 多层印制电路板 | mulitlayer printed circuit board |
| 多层印制线路板 | mulitlayer prited wiring board |
| 刚性印制板 | rigid printed board |
| 刚性单面印制板 | rigid single-sided printed borad |
| 刚性双面印制板 | rigid double-sided printed borad |
| 刚性多层印制板 | rigid multilayer printed board |
| 挠性多层印制板 | flexible multilayer printed board |
| 挠性印制板 | flexible printed board |
| 挠性单面印制板 | flexible single-sided printed board |
| 挠性双面印制板 | flexible double-sided printed board |
| 挠性印制电路 | flexible printed circuit (FPC) |
| 挠性印制线路 | flexible printed wiring |
| 刚性印制板 | flex-rigid printed board, rigid-flex printed board |
| 刚性双面印制板 | flex-rigid double-sided printed board, rigid-flex double-sided printed |
| 刚性多层印制板 | flex-rigid multilayer printed board, rigid-flex multilayer printed board |
| 齐平印制板 | flush printed board |
| 金属芯印制板 | metal core printed board |
| 金属基印制板 | metal base printed board |
| 多重布线印制板 | mulit-wiring printed board |
| 陶瓷印制板 | ceramic substrate printed board |
| 导电胶印制板 | electroconductive paste printed board |
| 模塑电路板 | molded circuit board |
| 模压印制板 | stamped printed wiring board |
| 顺序层压多层印制板 | sequentially-laminated mulitlayer |
| 散线印制板 | discrete wiring board |
| 微线印制板 | micro wire board |
| 积层印制板 | buile-up printed board |
| 积层多层印制板 | build-up mulitlayer printed board (BUM) |
| 积层挠印制板 | build-up flexible printed board |
| 表面层合电路板 | surface laminar circuit (SLC) |
| 埋入凸块连印制板 | B2it printed board |
| 多层膜基板 | multi-layered film substrate(MFS) |
| 层间全内导通多层印制板 | ALIVH multilayer printed board |
| 载芯片板 | chip on board (COB) |
| 埋电阻板 | buried resistance board |
| 母板 | mother board |
| 子板 | daughter board |
| 背板 | backplane |
| 裸板 | bare board |
| 键盘板夹心板 | copper-invar-copper board |
| 动态挠性板 | dynamic flex board |
| 静态挠性板 | static flex board |
| 可断拼板 | break-away planel |
| 电缆 | cable |
| 挠性扁平电缆 | flexible flat cable (FFC) |
| 薄膜开关 | membrane switch |
| 混合电路 | hybrid circuit |
| 厚膜 | thick film |
| 厚膜电路 | thick film circuit |
| 薄膜 | thin film |
| 薄膜混合电路 | thin film hybrid circuit |
| 互连 | interconnection |
| 导线 | conductor trace line |
| 齐平导线 | flush conductor |
| 传输线 | transmission line |
| 跨交 | crossover |
| 板边插头 | edge-board contact |
| 增强板 | stiffener |
| 基底 | substrate |
| 基板面 | real estate |
| 导线面 | conductor side |
| 元件面 | component side |
| 焊接面 | solder side |
| 印制 | printing |
| 网格 | grid |
| 图形 | pattern |
| 导电图形 | conductive pattern |
| 非导电图形 | non-conductive pattern |
| 字符 | legend |
| 标志 | mark |
基材词汇
| 基材 | base material |
| 层压板 | laminate |
| 覆金属箔基材 | metal-clad bade material |
| 覆铜箔层压板 | copper-clad laminate (CCL) |
| 单面覆铜箔层压板 | single-sided copper-clad laminate |
| 双面覆铜箔层压板 | double-sided copper-clad laminate |
| 复合层压板 | composite laminate |
| 薄层压板 | thin laminate |
| 金属芯覆铜箔层压板 | metal core copper-clad laminate |
| 金属基覆铜层压板 | metal base copper-clad laminate |
| 挠性覆铜箔绝缘薄膜 | flexible copper-clad dielectric film |
| 基体材料 | basis material |
| 预浸材料 | prepreg |
| 粘结片 | bonding sheet |
| 预浸粘结片 | preimpregnated bonding sheer |
| 环氧玻璃基板 | epoxy glass substrate |
| 加成法用层压板 | laminate for additive process |
| 预制内层覆箔板 | mass lamination panel |
| 内层芯板 | core material |
| 催化板材 | catalyzed board ,coated catalyzed laminate |
| 涂胶催化层压板 | adhesive-coated catalyzed laminate |
| 涂胶无催层压板 | adhesive-coated uncatalyzed laminate |
| 粘结层 | bonding layer |
| 粘结膜 | film adhesive |
| 涂胶粘剂绝缘薄膜 | adhesive coated dielectric film |
| 无支撑胶粘剂膜 | unsupported adhesive film |
| 覆盖层 | cover layer (cover lay) |
| 增强板材 | stiffener material |
| 铜箔面 | copper-clad surface |
| 去铜箔面 | foil removal surface |
| 层压板面 | unclad laminate surface |
| 基膜面 | base film surface |
| 胶粘剂面 | adhesive faec |
| 原始光洁面 | plate finish |
| 粗面 | matt finish |
| 纵向 | length wise direction |
| 模向 | cross wise direction |
| 剪切板 | cut to size panel |
| 酚醛纸质覆铜箔板 | phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) |
| 环氧纸质覆铜箔板 | epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) |
| 环氧玻璃布基覆铜箔板 | epoxide woven glass fabric copper-clad laminates |
| 环氧玻璃布纸复合覆铜箔板 | epoxide cellulose paper core, glass cloth surfaces copper-clad laminates |
| 环氧玻璃布玻璃纤维复合覆铜箔板 | epoxide non woven/woven glass reinforced copper-clad laminates |
| 聚酯玻璃布覆铜箔板 | ployester woven glass fabric copper-clad laminates |
| 聚酰亚胺玻璃布覆铜箔板 | polyimide woven glass fabric copper-clad laminates |
| 双马来酰亚胺三嗪环氧玻璃布覆铜箔板 | bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates |
| 环氧合成纤维布覆铜箔板 | epoxide synthetic fiber fabric copper-clad laminates |
| 聚四乙烯玻璃纤维覆铜箔板 | teflon/fiber glass copper-clad laminates |
| 超薄型层压板 | ultra thin laminate |
| 陶瓷基覆铜箔板 | ceramics base copper-clad laminates |
| 紫外线阻挡型覆铜箔板 | UV blocking copper-clad laminates |
材料词汇
| A阶树脂 | A-stage resin |
| B阶树脂 | B-stage resin |
| C阶树脂 | C-stage resin |
| 环氧树脂 | epoxy resin |
| 酚醛树脂 | phenolic resin |
| 聚酯树脂 | polyester resin |
| 聚酰亚胺树脂 | polyimide resin |
| 双马来酰亚胺三嗪树脂 | bismaleimide-triazine resin |
| 丙烯酸树脂 | acrylic resin |
| 三聚氰胺甲醛树脂 | melamine formaldehyde resin |
| 多官能环氧树脂 | polyfunctional epoxy resin |
| 溴化环氧树脂 | brominated epoxy resin |
| 环氧酚醛 | epoxy novolac |
| 氟树脂 | fluroresin |
| 硅树脂 | silicone resin |
| 硅烷 | silane |
| 聚合物 | polymer |
| 无定形聚合物 | amorphous polymer |
| 结晶现象 | crystalline polamer |
| 双晶现象 | dimorphism |
| 共聚物 | copolymer |
| 合成树脂 | synthetic |
| 热固性树脂 | thermosetting resin |
| 热塑性树脂 | thermoplastic resin |
| 感光性树脂 | photosensitive resin |
| 环氧当量 | weight per epoxy equivalent (WPE) |
| 环氧值 | epoxy value |
| 双氰胺 | dicyandiamide |
| 粘结剂 | binder |
| 胶粘剂 | adesive |
| 固化剂 | curing agent |
| 阻燃剂 | flame retardant |
| 遮光剂 | opaquer |
| 增塑剂 | plasticizers |
| 不饱和聚酯 | unsatuiated polyester |
| 聚酯薄膜 | polyester |
| 聚酰亚胺薄膜 | polyimide film (PI) |
| 聚四氟乙烯 | polytetrafluoetylene (PTFE) |
| 聚全氟乙烯丙烯薄膜 | perfluorinated ethylene-propylene copolymer film (FEP) |
| 增强材料 | reinforcing material |
| 玻璃纤维 | glass fiber |
| E玻璃纤维 | E-glass fibre |
| D玻璃纤维 | D-glass fibre |
| S玻璃纤维 | S-glass fibre |
| 玻璃布 | glass fabric |
| 非织布 | non-woven fabric |
| 玻璃纤维垫 | glass mats |
| 纱线 | yarn |
| 单丝 | filament |
| 绞股 | strand |
| 纬纱 | weft yarn |
| 经纱 | warp yarn |
| 但尼尔 | denier |
| 经向 | warp-wise |
| 纬向 | weft-wise, filling-wise |
| 织物经纬密度 | thread count |
| 织物组织 | weave structure |
| 平纹组织 | plain structure |
| 坏布 | grey fabric |
| 稀松织物 | woven scrim |
| 弓纬 | bow of weave |
| 断经 | end missing |
| 缺纬 | mis-picks |
| 纬斜 | bias |
| 折痕 | crease |
| 云织 | waviness |
| 鱼眼 | fish eye |
| 毛圈长 | feather length |
| 厚薄段 | mark |
| 裂缝 | split |
| 捻度 | twist of yarn |
| 浸润剂含量 | size content |
| 浸润剂残留量 | size residue |
| 处理剂含量 | finish level |
| 浸润剂 | size |
| 偶联剂 | couplint agent |
| 处理织物 | finished fabric |
| 聚酰胺纤维 | polyarmide fiber |
| 聚酯纤维非织布 | non-woven polyester fabric |
| 浸渍绝缘纵纸 | impregnating insulation paper |
| 81、 聚芳酰胺纤维纸：aromatic polyamide paper | |
| 82、 断裂长：breaking length | |
| 83、 吸水高度：height of capillary rise | |
| 84、 湿强度保留率：wet strength retention | |
| 85、 白度：whitenness | |
| 86、 陶瓷：ceramics | |
| 87、 导电箔：conductive foil | |
| 88、 铜箔：copper foil | |
| 89、 电解铜箔：electrodeposited copper foil (ED copper foil) | |
| 90、 压延铜箔：rolled copper foil |
| 退火铜箔 | annealed copper foil |
| 压延退火铜箔 | rolled annealed copper foil (RA copper foil) |
| 薄铜箔 | thin copper foil |
| 涂胶铜箔 | adhesive coated foil |
| 涂胶脂铜箔 | resin coated copper foil (RCC) |
| 复合金属箔 | composite metallic material |
| 载体箔 | carrier foil |
| 殷瓦 | invar |
| 箔（剖面）轮廓 | foil profile |
| 光面 | shiny side |
| 粗糙面 | matte side |
| 处理面 | treated side |
| 防锈处理 | stain proofing |
| 双面处理铜箔 | double treated foil |
设计词汇
| 原理图 | shematic diagram |
| 逻辑图 | logic diagram |
| 印制线路布设 | printed wire layout |
| 布设总图 | master drawing |
| 可制造性设计 | design-for-manufacturability |
| 计算机辅助设计 | computer-aided design.(CAD) |
| 计算机辅助制造 | computer-aided manufacturing.(CAM) |
| 计算机集成制造 | computer integrat manufacturing.(CIM) |
| 计算机辅助工程 | computer-aided engineering.(CAE) |
| 计算机辅助测试 | computer-aided test.(CAT) |
| 电子设计自动化 | electric design automation .(EDA) |
| 工程设计自动化 | engineering design automaton .(EDA2) |
| 组装设计自动化 | assembly aided architectural design. (AAAD) |
| 计算机辅助制图 | computer aided drawing |
| 计算机控制显示 | computer controlled display .(CCD) |
| 布局 | placement |
| 布线 | routing |
| 布图设计 | layout |
| 重布 | rerouting |
| 模拟 | simulation |
| 逻辑模拟 | logic simulation |
| 电路模拟 | circit simulation |
| 时序模拟 | timing simulation |
| 模块化 | modularization |
| 布线完成率 | layout effeciency |
| 机器描述格式 | machine descriptionm format .(MDF) |
| 机器描述格式数据库 | MDF databse |
| 设计数据库 | design database |
| 设计原点 | design origin |
| 优化（设计） | optimization (design) |
| 供设计优化坐标轴 | predominant axis |
| 表格原点 | table origin |
| 镜像 | mirroring |
| 驱动文件 | drive file |
| 中间文件 | intermediate file |
| 制造文件 | manufacturing documentation |
| 队列支撑数据库 | queue support database |
| 元件安置 | component positioning |
| 图形显示 | graphics dispaly |
| 比例因子 | scaling factor |
| 扫描填充 | scan filling |
| 矩形填充 | rectangle filling |
| 填充域 | region filling |
| 实体设计 | physical design |
| 逻辑设计 | logic design |
| 逻辑电路 | logic circuit |
| 层次设计 | hierarchical design |
| 自顶向下设计 | top-down design |
| 自底向上设计 | bottom-up design |
| 线网 | net |
| 数字化 | digitzing |
| 设计规则检查 | design rule checking |
| 走（布）线器 | router (CAD) |
| 网络表 | net list |
| 计算机辅助电路分析 | computer-aided circuit analysis |
| 子线网 | subnet |
| 目标函数 | objective function |
| 设计后处理 | post design processing (PDP) |
| 交互式制图设计 | interactive drawing design |
| 费用矩阵 | cost metrix |
| 工程图 | engineering drawing |
| 方块框图 | block diagram |
| 迷宫 | moze |
| 元件密度 | component density |
| 巡回售货员问题 | traveling salesman problem |
| 自由度 | degrees freedom |
| 入度 | out going degree |
| 出度 | incoming degree |
| 曼哈顿距离 | manhatton distance |
| 欧几里德距离 | euclidean distance |
| 网络 | network |
| 阵列 | array |
| 段 | segment |
| 逻辑 | logic |
| 逻辑设计自动化 | logic design automation |
| 分线 | separated time |
| 分层 | separated layer |
| 定顺序 | definite sequence |
形状与尺寸词汇
| 导线（通道） | conduction (track) |
| 导线（体）宽度 | conductor width |
| 导线距离 | conductor spacing |
| 导线层 | conductor layer |
| 导线宽度/间距 | conductor line/space |
| 第一导线层 | conductor layer No.1 |
| 圆形盘 | round pad |
| 方形盘 | square pad |
| 菱形盘 | diamond pad |
| 长方形焊盘 | oblong pad |
| 子弹形盘 | bullet pad |
| 泪滴盘 | teardrop pad |
| 雪人盘 | snowman pad |
| V形盘 | V-shaped pad |
| 环形盘 | annular pad |
| 非圆形盘 | non-circular pad |
| 隔离盘 | isolation pad |
| 非功能连接盘 | monfunctional pad |
| 偏置连接盘 | offset land |
| 腹（背）裸盘 | back-bard land |
| 盘址 | anchoring spaur |
| 连接盘图形 | land pattern |
| 连接盘网格阵列 | land grid array |
| 孔环 | annular ring |
| 元件孔 | component hole |
| 安装孔 | mounting hole |
| 支撑孔 | supported hole |
| 非支撑孔 | unsupported hole |
| 导通孔 | via |
| 镀通孔 | plated through hole (PTH) |
| 31、 余隙孔：access hole | |
| 32、 盲孔：blind via (hole) | |
| 33、 埋孔：buried via hole | |
| 34、 埋/盲孔：buried /blind via | |
| 35、 任意层内部导通孔：any layer inner via hole (ALIVH) | |
| 36、 全部钻孔：all drilled hole | |
| 37、 定位孔：toaling hole | |
| 38、 无连接盘孔：landless hole | |
| 39、 中间孔：interstitial hole | |
| 40、 无连接盘导通孔：landless via hole |
| 引导孔 | pilot hole |
| 端接全隙孔 | terminal clearomee hole |
| 准表面间镀覆孔 | quasi-interfacing plated-through hole |
| 准尺寸孔 | dimensioned hole |
| 在连接盘中导通孔 | via-in-pad |
| 孔位 | hole location |
| 孔密度 | hole density |
| 孔图 | hole pattern |
| 钻孔图 | drill drawing |
| 装配图 | assembly drawing |
| 印制板组装图 | printed board assembly drawing |
| 参考基准 | datum referan |
AD封装系列
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