ASM太平洋科技有限公司ASM PACIFIC TECHNOLOGY LIMITED
集团行政总裁Group Chief Executive Officer
黄梓达先生Mr. Robin Ng
2021年注定是半导体历史上极不平凡的一年。新冠疫情叠加上种种其他因素，使全球供应链从2020年第四季度开始陷入史无前例的紧张状态，对各类芯片的需求强势复苏。半导体行业于过往十年经历难得一遇的大发展，中国的半导体封测市场表现尤为突出，在产业链占比更进一步提升。临近2021年末，随着设备订单交付情况改善，集团客户的产能使用率逐步恢复正常，然而上游晶圆厂产能依旧紧张，而中国半导体封测产业亦正加快步伐赶上世界的先进科技水平。集团深信中国半导体行业未来将会维持强劲势头！
展望2022，世界正在快速步入绿色能源和全面智能化的新时代，以5G网络为基础，汽车行业不单会加快未来转型至洁净能源的进程，高度智能化也是必然的发展趋势；日常生活也将进一步全面数码化。这必将带动第三代半导体（如碳化硅）、各类传感器、光通信模块、存储器、先进封装及异构整合流程（Heterogeneous Integration）、高频高速多层PCB表面贴装的需求及进一步发展，此正是ASMPT的优势所在。集团必定会竭尽所能在通信、AI、云端服务、新能源、物联网、车联网、自动驾驶、AR/VR以及先进工业自动化管理等新兴领域中作出贡献。
The year 2021 is bound to be a very unusual year in semiconductor history. COVID-19, overlaid with various other factors, has caused unprecedented tensions in the global supply chain since the fourth quarter of 2020. It also caused the strong revival of demand for various chips. The semiconductor industry has undergone extraordinary developments in the past 10 years. China's assembly and testing market has performed particularly well, and its share in the industrial chain has further increased. Towards the end of 2021, with the improvement of equipment delivery, the capacity utilization rate of our customers has gradually returned to normal, but the capacity of upstream wafer fabs is still tight, and China's semiconductor assembly and testing industry is rapidly catching up with the world's advanced technology. We believe that China's semiconductor industry will remain its robust momentum in the coming years!
Looking forward to 2022, the world is rapidly entering a new era of green energy and comprehensive intelligence. Riding on 5G networks, the automotive industry will not only accelerate the future transformation to clean energy, but also a high degree of intelligence is an inevitable development trend. Daily life will also be further digitized. This will inevitably drive the further development and demand for third-generation semiconductors (such as silicon carbide), various sensors, optical communication modules, memory modules, advanced packaging and heterogeneous integration processes for high performance computing, and high-frequency and high-speed multi-layer PCB surface mounting! This is also the advantage of ASMPT! We will make every effort to contribute to the semiconductor industry in emerging fields such as communications, AI, cloud services, new energy, Internet of Things, Internet of Vehicles, autonomous driving, AR / VR and advanced industrial automation management!
