拆解ThunderBolt：LTE成本太高下一代iPhone或弃用

根据IHS iSuppli的拆解分析，如果有关下一代iPhone将采用4G LTE技术的传言属实，苹果公司新手机的生产成本很可能比目前的iPhone 4高很多。

HTC ThunderBolt所采用的4G LTE无线标准将成本增加了39.75美元，这在ThunderBolt的物料成本(BOM)中占据很大比重。事实上ThunderBolt 262美元的BOM成本是IHS拆解过的智能手机中最高的，直逼多媒体平板。

首款LTE手机HTC ThunderBolt

IHS高级分析师Wayne Lam表示：“将在9月发布的下一代iPhone会不会支持4G LTE标准尚有待观察。不过假如它支持，有两点可以肯定。首先，为了支持第一代LTE基带处理器以及相配套的芯片组，iPhone小巧的PCB板必须变大；其次，如果它的LTE实现与HTC Thunderbolt相近，下一代iPhone的BOM成本肯定会比iPhone 4高很多。”

HTC ThunderBolt LTE部分BOM成本清单

根据IHS今年2月所进行的拆解，CDMA版iPhone 4的BOM成本为171.35美元。如果苹果公司像HTC ThunderBolt那样采用第一代LTE芯片和基带设计，CDMA版iPhone 4的BOM成本会增加23.2%，达到211.1美元。这还不包括可能会导致成本增加的其它设计变动。

IHS通信与消费类电子首席分析师Jagdish Rebello表示，如果苹果公司选择为2011年发售的下一代iPhone增加LTE支持，它很可能会采用高通的芯片组，CDMA和HSDPA版本可能还会采用不同的基带解决方案，就像HTC ThunderBolt一样。尽管这么做昂贵而且复杂，但这样也能让下一代iPhone同时支持Verizon和AT&T未来的LTE网络，与此同时也能兼容其它运营商现有的3G网络。

下一页：下一代iPhone的选择

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不过苹果公司近期的评论表明该公司不会选择与HTC相同的设计方向。

苹果首席运营官Peter Oppenheimer在今年4月的公司营收会议上说：“第一代LTE芯片组需要我们在手机设计上作出太多妥协，其中有些是我们所无法接受的。”

该申明与IHS的拆解报告显示出苹果公司可能会寻求一种更高效的半导体解决方案来增加LTE支持。

已经有了一种比ThunderBolt更高效的LTE实现方案：高通现在提供SnapDragon MSM8960芯片，ThunderBolt所用MSM8655芯片的后续产品，在单颗芯片上集成了LTE、EVDO和HSPA支持。MSM8960不但不需要手机采用ThunderBolt的多个基带芯片方案，对生产成本和电路板尺寸所造成的影像也比ThunderBolt更小。

HTC没有采用MSM8960的原因是开发ThunderBolt的时候该芯片尚未登陆市场。

不过IHS无线通信高级分析师Tina Teng指出，即便是新的MSM8960芯片也需要增加更多元件，包括功率放大器、RF元件和开关。一般认为苹果公司更专注于在为下一代iPhone带来更薄的外形，苹果公司可能不会在今年的产品中增加LTE支持。

高通的下一代LTE解决方案将在2012年公布，届时将允许苹果公司以更低的成本生产LTE iPhone。苹果公司可能将在2012年第二季度推出此产品。

点击参考原文：Teardown of HTC ThunderBolt Provides Insights on Rumored LTE iPhone

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Teardown of HTC ThunderBolt Provides Insights on Rumored LTE iPhone

If the rumors are true that the next-generation iPhone will support 4G long-term evolution (LTE), the new Apple Inc. smartphone likely will be significantly more expensive to make than the current iPhone 4 model, according to the IHS iSuppli Teardown Analysis Service from information and analysis provider IHS (NYSE: IHS).

The use of the 4G LTE wireless standard in the HTC ThunderBolt added $39.75 to the cost of the smartphone, representing a major contribution to the cellphone’s sizable bill of materials (BOM). In fact, at$262, the ThunderBolt carries the highest BOM cost of any smartphone IHS has ever torn down, rivaling the expense of media tablets.

“It remains to be seen whether the next Apple iPhone set for introduction in September will support 4G LTE,” said Wayne Lam, senior analyst for IHS. “However, if it does, two things are clear. First, the iPhone’s minuscule printed circuit board (PCB) will have to grow in size in order to support the first-generation LTE baseband processor as well as all the supporting chipset. Second, the next iPhone’s BOM value certainly will increase substantially compared to the iPhone 4 if LTE is implemented in the same manner as in the HTC Thunderbolt.”

The code division multiple access (CDMA) version of the iPhone 4, currently offered by Verizon, carried a BOM of $171.35, based on the IHS teardown from February. If Apple used the same first-generation LTE chips and baseband design as HTC did in the ThunderBolt, BOM of the CDMA iPhone 4 will rise to$211.10, a 23.2 percent increase—not including any other changes to the design that could further raise the materials cost.

If Apple chooses to add LTE to its next-generation iPhone in 2011, it could use a Qualcomm Inc. chipset, and might also include separate baseband solutions to provide support for the CDMA2000-1x-EVDO and 3G high-speed downlink packet access (HSDPA) air standards, a similar design approach as the ThunderBolt, according to Dr. Jagdish Rebello, senior director and principal analyst, communications and consumer electronics, for IHS. While expensive and complex, this approach would allow the next iPhone to run on Verizon’s LTE network as well as AT&T’s LTE network when available, while at the same time maintaining backward compatibility with the existing 3G networks of other operators.

However, recent comments from Apple indicate the company will not take the same design approach as HTC did.

“The first generation of LTE chipsets forced a lot of design compromises with the handset, and some of those we are just not willing to make,” said Peter Oppenheimer, Apple chief operating officer, speaking at the company’s April 2011 earnings call.

The remark, in addition to the IHS teardown findings, indicates that Apple may seek a more efficient semiconductor solution for adding LTE to the iPhone.

A more efficient solution for implementing LTE exists now than the approach taken in the ThunderBolt: Qualcomm at present is offering the SnapDragon MSM8960, a successor to the MSM8655 used in the ThunderBolt that combines LTE, EVDO and HSPA into a single chip. This new device not only eliminates the multiple baseband chipset approach employed by theThunderBolt, but also would reduce the size and cost of making an LTE-enabled iPhone 5 compared to the ThunderBolt.

HTC did not use the new MSM8960 as it was not available when the company was planning the ThunderBolt.

However, even the new MSM8960 will require the addition of more components, including power amplifiers, radio frequency components and switches, noted Tina Teng, senior analyst, wireless communications, for IHS. With Apple expected to focus on a thinner form factor for the next iPhone, Apple may not choose to implement LTE in its product rollouts this year because of these additional components.

Qualcomm’s next-generation LTE solution is set to be introduced in 2012, which would allow Apple to produce an LTE-enabled iPhone at even lower costs. Apple is likely to be in a position to release this product in the second quarter of 2012.