UBM拆解：探秘任天堂3DS内部

以下是电子工程专辑合作伙伴UBM TechInsights分析师对任天堂的新款3DS掌上游戏系统拆解分析的系列图片。

UBM TechInsights本周稍早的时候透露，在拆解3DS的时候发现两个富士通半导体的FCRAM(fast-cycle RAM)内存(参看电子工程专辑报道：

任天堂3DS拆解：富士通FCRAM或成隐患？)。这是UBM首次在拆解中发现富士通的专利技术。

本周二(3月29日)，UBM TechInsights公布了拆解中发现的完整部件清单。据UBM TechInsights说，除了清单中列出的部件，该设备的一大特色是采用了夏普制造的一个3D主显示屏和触摸显示屏，三个VGA摄像头和一个3.7V、1,300mAh的锂电池。

UBM TechInsights技术营销经理Allan Yogasingam说：“总的来说，我们现在看到的是一个传统的任天堂掌机设计。”他说，拆解发现任天堂沿用了Atheros、NEC、三星电子等公司提供的部件，之前的DSi、DS XL等产品了也采用这些公司的部件。

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裸眼3D，大胆的尝试

Yogasingam说，任天堂选择夏普无须佩戴3D眼镜的并行主动式3D显示技术(即裸眼3D技术)，是一个大胆的尝试。但是在玩某些游戏的时候，感觉3D的效果确实很逼真。

他还说，采用富士通的FCRAM替代LPDDR2内存，是任天堂设计要承担的少数风险之一。据富士通表示，FCRAM功耗与LPDRR2相当，但性能足以媲美DDR3内存。

由于FCRAM是富士通的专利技术，包括IHS iSuppli在内的一些分析师都警告说，采用该技术可能会给任天堂带来麻烦。由于价格在内的种种原因，消费电子供应商通常宁愿选择具有多家制造商而非货源单一的内存产品。

“处理器拥有自己的闪存已经足够吸引任天堂去承担单一内存货源的风险。”Yogasingam说，“不像LPDDR2有尔必达，Hynix和三星等多家制造商，FCRAM是富士通专有的。倘若最近日本地震或海啸这类灾害事件影响到富士通的生产，任天堂将面临整体生产延误的风险。”

UBM TechInsights是电子工程专辑美国网站的合作伙伴。

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任天堂3DS

在日本购买的任天堂3DS全貌。在美国该产品零售价约为250美元。

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取下后盖

取下3DS后盖，露出记忆卡插槽和内存插槽。

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主板

任天堂3DS的主板，包括所有已鉴定过的主芯片。

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夏普制造的3D显示屏

近看夏普制造的3D显示屏

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点击参考原文：Teardown slideshow: Inside the Nintendo 3DS

编译：Aileen Zhu

《电子工程专辑》网站版权所有，谢绝转载

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Teardown slideshow: Inside the Nintendo 3DS

Dylan McGrath

The following is a slideshow of images created during a teardown analysis of Nintendo Co. Ltd.'s new 3DS handheld gaming system performed by analysts at UBM TechInsights.

UBM TechInsights said earlier this week revealed that it found within the 3DS two Fujitsu Semiconductor Ltd. fast-cycle RAM (FCRAM) memories. It was the first time UBM TechInsights found the proprietary Fujitsu technology in a teardown.

On Tuesday (March 29), UBM TechInsights provided a fuller listing of the parts found inside the 3DS during the teardown. In addition to the listed parts, UBM TechInsights said the handheld features a primary 3-D display and secondary touchscreen display made by Sharp Electronics Corp., thee VGA cameras and a 3.7 volt, 1,300 mAh lithium-ion battery.

"Generally, what we’re seeing here is a traditional Nintendo handheld design," said Allan Yogasingam, a technical marketing manager at UBM TechInsights. Yogasingam said the teardown found Nintendo standbys such as Atheros Communications Inc., NEC Corp., Samsung Electronics Co. Ltd. and others that have supplied parts to Nintendos previous handhelds such as the DSi and the DS XL.

Yogasingam said Nintendo took a gutsy approach by choosing a Sharp parallel autostereoscopic 3-D display technology, which does not require 3-D glasses. "But in playing some of the games, the feeling of 3-D feels very organic," Yogasingam said.

Yogasingam said going with Fujitsu's FCRAM over LPDDR2 DRAM was one of the few riskier design choices Nintendo took. According to Fujitsu, FCRAM offers similar power consumption to that of LPDRR2, but with performance that matches DDR3 DRAM.

Because FCRAM is a proprietary Fujitsu technology, some analysts, including those at market research firm IHS iSuppli, have warned that its inclusion could create problems for Nintendo. Consumer electronics vendors typically prefer to choose commodity memories over single-source parts for many reasons, including price.

"Having quick access memory for their processor must have been appealing enough to Nintendo to take the risk of single-sourcing the memory," Yogasingam said. "Unlike LPDDR2, which has numerous manufacturers like Elpida, Hynix and Samsung, FCRAM is proprietary to Fujitsu. In the event that recent events like the earthquake or tsunami in Japan affected production to Fujitsu, Nintendo faces a risk of overall production delays."

UBM TechInsights is owned by United Business Media, the parent company of EE Times.