任天堂3DS拆解：富士通FCRAM或成隐患？

根据UBM TechInsights的拆解分析报告，任天堂支持裸眼3D技术的掌机3DS采用了两个富士通半导体的FCRAM(Fast-Cycle RAM)存储器，这是UBM拆解中首次发现该部件。

据富士通表示，消费类FCRAM旨在应对数字电视和数码摄像机显示和视频处理的高速数据传输要求。其用于消费电子设备的FCRAM提供一个低功耗SDRAM接口，可实现高速率低功耗数据传输。经UBM鉴定，一个富士通FCRAM的容量为64MB。

富士通FCRAM MB81EDS516545芯片。来源：UBM TechInsights

“这意味着3DS拥有128MB内存，FCRAM的使用连接了与之类似的DDR内存，同时以一个较低的运行频率与DDR的性能相匹配。”UBM技术营销经理Allan Yogasingam说，“该部件的使用真是令人印象深刻。”

任天堂3DS

市场研究机构IHS iSuppli也对3DS进行了拆解。拆解报告称，富士通专有技术FCRAM的存在，会是任天堂的一个潜在问题。

“通常，大多数电子系统设计会采用多家供应商的内存产品，以减少供应的风险，也可保障成本。”IHS iSuppli公司拆解服务部高级主管Andrew Rassweiler说，“然而，任天堂采用富士通独家供应的决定增加了供应链的风险，同时限制了任天堂从一个主要部件来降低成本的潜力。”

本周EE Times将发布UBM TechInsights完整的3DS的拆解报告，包括照片。

下一页：BOM成本100.71美元

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据IHS iSuppli初步分析得出的结论认为，星期天冲击了美国零售商店的3DS，BOM成本为100.71美元，总共制造成本为103.25美元，制造成本2.54美元。而该掌机在美国的零售价为250美元。

根据iSuppli的报告，与两年前发布的任天堂前一款产品DSi相比，3DS的BOM成本增加了33%，而售价却只增加了一点。

任天堂DSi

除了富士通的FCRAM，IHS iSuppli的3DS拆解还发现一个应该是夏普在美国制造的应用处理器，三星的NAND闪存，InvenSense和意法半导体的MEMS传感器，一个Atheros的独立WLAN芯片模块和三个可供用户拍摄3D照片的摄像头。由夏普制造的3.5英寸，800x240像素3D显示屏也是3DS的一大特色。

iSuppli认为，虽然3DS主要使用日本供应商的组件，但不能确定311地震和海啸是否会给该设备的组件供应商带来什么明确的影响。然而，困扰着大多数日本行业的后勤和电力问题可能对该游戏设备的生产和销售造成影响。

印有富士通标识的芯片FCRAM MB81EDS516545

点击参考原文：Teardowns find Fujitsu FCRAM in Nintendo 3DS

编译：Aileen Zhu

《电子工程专辑》网站版权所有，谢绝转载

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Teardowns find Fujitsu FCRAM in Nintendo 3DS

Dylan McGrath

A teardown analysis conducted by UBM TechInsights of Nintendo Co. Ltd.'s 3DS handheld 3-D gaming device revealed that the device uses two Fujitsu Semiconductor Ltd. Fast-Cycle RAM (FCRAM) memories, the first time the part has been found in a UBM TechInsights teardown, according to the firm.

According to Fujitsu, FCRAM for consumer electronics devices offers a low power SDRAM interface and enables high-speed data transfer with low power consumption. Consumer FCRAM is intended for digital TVs and digital video cameras that require high-speed data transfer for display and video processing, according to the company. Each part identified by UBM TechInsights offers 64MB of RAM.

"This means is the 3DS has 128 MB of RAM, and the use of FCRAM interfaces similarly to DDR memory while matching the performance of DDR3 memory at a lower operating frequency," said Allan Yogasingam, a technical marketing manager at UBM TechInsights. "Pretty impressive stuff really."

Market research firm IHS iSuppli, which also conducted a teardown of the Nintendo 3DS, said the existence of FCRAM—a proprietary Fujitsu technology—is a potential problem for Nintendo.

"As a rule, most electronic system designers employ memory products that are available from multiple sources in order to reduce supply risk and to guarantee the best pricing," said Andrew Rassweiler, senior director of teardown services for IHS. "However, Nintendo’s decision to buy the device from sole-source Fujitsu adds supply chain risk, and limits Nintendo’s capability to drive costs down on a major component."

Close up die image of the Fujitsu MB81EDS516545 FCRAM. Source: UBM TechInsights (click on image to enlarge).

EE Times will publish a full report on UBM TechInsights' 3DS teardown, including photos, later this week. UBM TechInsights is owned by United Business Media, the parent company of EE Times.

IHS iSuppli's preliminary analysis concluded that the 3DS—which hit U.S. stores Sunday—has a bill of materials (BOM) of $100.71 and a total manufacturing cost of $103.25, including a $2.54 manufacturing cost. The system retails for $250 in the U.S.

The 3DS BOM represents a 33 percent increase over the previous member of Nintendo's handheld gaming line, the Nintendo DSi, based on pricing from the time of its introduction a little more than two years ago, according to IHS iSuppli.

In addition to the Fujitsu FCRAM, the IHS iSuppli 3DS teardown revealed an applications processor that the firm believes is manufactured in the U.S. by Sharp Electronics Corp., NAND flash memory from Samsung Electronics Co. Ltd., MEMS sensors from InvenSense Inc. and ST Microelectronics, a single-chip WLAN module from Atheros Communications Inc. and a three-camera subsystem that allows users to take 3-D photographs. The 3DS also features a 3-D display made by Sharp that measures 3.5-inches in size with a total 800 by 240 pixel format, according it IHS iSuppli.

Though the 3DS largely uses components from suppliers based in Japan, IHS iSuppli said it cannot identify any specific supply problems for the device's components brought on by the March 11 earthquake and tsunami. However, the firm said the logistical and power challenges plaguing most Japanese industries could impact production and distribution of this game system.

Die markings on the Fujitsu MB81EDS516545 FCRAM. Source: UBM TechInsights (click on image to enlarge).