Intel成都公司灾后重新开工

Intel在本周二（5月20日）表示，其位于四川成都的芯片封装和测试工厂现已恢复运转。该工厂距5月12日汶县大地震的震源中心仅55英里。

“我们以最快的速度恢复生产”，Intel发言人Chuck Mulloy表示，但他没有说明工厂的产能何时能恢复到地震前。

Mulloy称Intel成都分工厂在上周五对工厂的供电系统和机器进行了检查，上周日就已经开工。

Intel成都工厂主要负责包装和测试芯片组件，虽然在上周的地震中受了一点表面损害，但经地震分析表明没有结构性硬伤。

此外，Intel成都分工厂的1，600名员工无一伤亡。上周地震强度高达8.0级，约有70,000人在此次地震中死亡或失踪。

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Intel's Chengdu plant reopens after China quake

Intel Corp. said Tuesday (May 20) it has reopened its chip assembly and test facility in Chengdu, China, a site 55 miles from the epicenter of the massive earthquake that rattled Sichuan province on May 12.

"We are ramping it up as fast as we can," Intel spokesman Chuck Mulloy said, without giving an estimate on when the facility would return to full capacity.

Mulloy said the company started powering up the plant and checking its machinery on Friday and output resumed Sunday.

The plant, which is used to package and test silicon components, suffered cosmetic damage in last week's quake, but seismic analysis revealed no structural damage, Mulloy said.

He added that none of the plant's 1,600 employees were hurt in the quake, which measured 7.9 at its epicenter and resulted in 70,000 people dead or missing. (Reporting by Amanda Beck, editing by Gerald E. McCormick)